公开(公告)号：US20170290217A1

公开(公告)日：2017-10-05

申请号：US15622988

申请日：2017-06-14

Applicant: LG CHEM, LTD.

Inventor： Se Ra KIM ,  Yoon Jeong BAEK ,  Jang Soon KIM ,  Jae Kwan LEE ,  Hyun Woo PARK

IPC: C09J133/04

CPC classification number: C09J7/22 ,  C08F220/14 ,  C08F220/18 ,  C09J4/06 ,  C09J7/38 ,  C09J133/04 ,  C09J133/08 ,  C09J133/10 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2423/006 ,  C09J2427/006 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/006 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/1476 ,  Y10T428/264 ,  Y10T428/266 ,  Y10T428/2891 ,  C08F2220/1808 ,  C08F2220/1825 ,  C08F2220/281

Abstract: The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided.