MICRO LIGHT EMITTING DIODE (LED) DISPLAY DEVICE

    公开(公告)号:US20250022864A1

    公开(公告)日:2025-01-16

    申请号:US18896638

    申请日:2024-09-25

    Abstract: The present disclosure relates to a micro light emitting diode (LED) display device including a substrate having a plurality of thin film transistors thereon; a plurality of micro light emitting devices (LEDs) on an upper surface of the substrate, the micro LEDs each having a protecting film provided with a first contact hole to expose a portion of an upper surface of a corresponding micro LED; at least one insulating layer covering the micro LED, the insulating layer provided with a second contact hole to expose a portion of the upper surface of the corresponding micro LED; and a connection electrode in the first contact hole and the second contact hole configured to transfer signals to the micro LED, wherein the first contact hole is larger than the second contact hole.

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

    公开(公告)号:US20230018566A1

    公开(公告)日:2023-01-19

    申请号:US17777597

    申请日:2020-03-10

    Inventor: Hyeon Ho SON

    Abstract: A display device and a manufacturing method of a display device are provided. The display device includes a substrate including a pixel defined thereon; a light emitting diode disposed in the pixel; an insulating layer covering the light emitting diode; a light collecting structure on at least a part of the insulating layer; and a reflective layer disposed at a side surface of the light collecting structure. The side surface of the light collecting structure may have a reverse tapered shape.

    MICRO LIGHT EMITTING DIODE (LED) DISPLAY DEVICE

    公开(公告)号:US20230056650A1

    公开(公告)日:2023-02-23

    申请号:US17977968

    申请日:2022-10-31

    Abstract: The present disclosure relates to a micro light emitting diode (LED) display device including a substrate having a plurality of thin film transistors thereon; a plurality of micro light emitting devices (LEDs) on an upper surface of the substrate, the micro LEDs each having a protecting film provided with a first contact hole to expose a portion of an upper surface of a corresponding micro LED; at least one insulating layer covering the micro LED, the insulating layer provided with a second contact hole to expose a portion of the upper surface of the corresponding micro LED; and a connection electrode in the first contact hole and the second contact hole configured to transfer signals to the micro LED, wherein the first contact hole is larger than the second contact hole.

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