公开(公告)号：US20240038823A1

公开(公告)日：2024-02-01

申请号：US18214238

申请日：2023-06-26

申请人： LG ELECTRONICS INC.

发明人： Taesu OH ,  Sungjin PARK ,  Myoungsoo KIM ,  Jungsub KIM

IPC分类号： H01L27/15 ,  G09G3/20 ,  H01L33/50 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L27/156 ,  G09G3/20 ,  H01L33/50 ,  H01L33/60 ,  H01L33/005 ,  G09G2300/0842

摘要： A semiconductor light emitting device package can include a first layer having a first region and a second region surrounding the first region, a common electrode wiring on the first region of the first layer, a plurality of semiconductor light emitting devices on the common electrode wiring, a plurality of electrode wirings on upper sides of the plurality of semiconductor light emitting devices, a plurality of electrode pads on the second region of the first layer, and a second layer on the plurality of semiconductor light emitting devices, the plurality of electrode wirings, and the plurality of electrode pads. The first layer and the second layer can have an elliptical shape. The plurality of electrode pads can include a first electrode pad, a second electrode pad, a third electrode pad, and at least one or more common electrode pads.

公开(公告)号：US20210313490A1

公开(公告)日：2021-10-07

申请号：US17266406

申请日：2018-08-29

申请人： LG ELECTRONICS INC.

发明人： Jungsub KIM ,  Sunghyun MOON ,  Younghak CHANG ,  Jina JEON

IPC分类号： H01L33/38 ,  H01L25/075 ,  H01L33/40 ,  H01L33/44

摘要： Discussed is a display device having a plurality of semiconductor light-emitting diodes. At least one of the semiconductor light-emitting diodes has a first conductive electrode and a second conductive electrode; a first conductive semiconductor layer on which the first conductive electrode is disposed; a second conductive semiconductor layer that overlaps with the first conductive semiconductor layer, and the second conductive electrode being disposed on the second conductive semiconductor layer; an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer; an undoped semiconductor layer disposed on the second conductive semiconductor layer; and protrusions formed of a porous material allowing electropolishing, and on the undoped semiconductor layer.

公开(公告)号：US20240332473A1

公开(公告)日：2024-10-03

申请号：US18578185

申请日：2021-07-28

申请人： LG ELECTRONICS INC.

发明人： Sunghyun MOON ,  Myoungsoo KIM ,  Yoonchul KIM ,  Jungsub KIM

IPC分类号： H01L33/62 ,  H01L25/16

CPC分类号： H01L33/62 ,  H01L25/167

摘要： The display device can include a barrier rib disposed on a substrate and having an assembly hole, a conductor in the assembly hole, and a semiconductor light emitting device disposed on the conductor within the assembly hole. The conductor can include a first conductor between the substrate and the semiconductor light emitting device, and a second conductor between the inside of the assembly hole and the outside of the semiconductor light emitting device.

公开(公告)号：US20230042942A1

公开(公告)日：2023-02-09

申请号：US17518391

申请日：2021-11-03

申请人： LG ELECTRONICS INC. ,  LG Display Co., Ltd.

发明人： Myoungsoo KIM ,  Changseo PARK ,  Minwoo LEE ,  Jungsub KIM

IPC分类号： H01L25/075 ,  H01L33/62

摘要： Discussed is a display device including a substrate, a plurality of first assembling wires on the substrate, a plurality of second assembling wires on the substrate, and separated from the plurality of first assembling wires; a first insulating layer disposed on the substrate, wherein a first hole is located on each of the plurality of second assembling wires, respectively, and wherein the first hole is not located on each of the plurality of first assembling wires; and a semiconductor light emitting device in the first hole.

公开(公告)号：US20210159269A1

公开(公告)日：2021-05-27

申请号：US17257190

申请日：2018-07-11

申请人： LG ELECTRONICS INC.

发明人： Jungsub KIM ,  Younghak CHANG ,  Myoungsoo KIM ,  Yeonhong JUNG

IPC分类号： H01L27/15 ,  H01L33/38 ,  H01L33/20 ,  H01L33/02

摘要： Discussed is a plurality of semiconductor light-emitting devices, wherein at least one of the semiconductor light-emitting devices includes: a first conductive electrode and a second conductive electrode; a first conductive semiconductor layer having the first conductive electrode arranged thereon; a second conductive semiconductor layer overlapping the first conductive semiconductor layer and having the second conductive electrode arranged thereon; an active layer arranged between the first conductive semiconductor layer and the second conductive semiconductor layer; an intermediate layer arranged on the second conductive semiconductor layer; a protrusion, made of an electro-polishable porous material, on the intermediate layer; and an undoped semiconductor layer arranged between the intermediate layer and the protrusion. The intermediate layer includes a first layer including second conductive impurities and a second layer having a higher concentration of the second conductive impurities than the first layer, wherein the first layer and the second layer are sequentially and repetitively stacked.

公开(公告)号：US20230420618A1

公开(公告)日：2023-12-28

申请号：US18265172

申请日：2020-12-04

申请人： LG ELECTRONICS INC.

发明人： Myoungsoo KIM ,  Minwoo LEE ,  Jungsub KIM ,  Junghoon KIM

IPC分类号： H01L33/48 ,  H01L25/16 ,  H01L27/12

CPC分类号： H01L33/483 ,  H01L25/167 ,  H01L27/124

摘要： The display device includes a substrate, a first wiring line on the substrate, a second wiring line on the substrate, and a first insulating member on the first wiring line and the second wiring line, a blocking member disposed across the first wiring line and the second wiring line, a second insulating member including a plurality of assembly holes, and a plurality of light emitting devices disposed in each of the plurality of assembly holes.
Each of the plurality of assembly holes includes a first region closer to the blocking member and a second region farther than the first region from the blocking member. A part of the blocking member is disposed in the first area of the assembly hole.

公开(公告)号：US20230327062A1

公开(公告)日：2023-10-12

申请号：US18017357

申请日：2020-07-21

申请人： LG ELECTRONICS INC.

发明人： Jungsub KIM ,  Myoungsoo KIM ,  Taein KWON ,  Chunghyun LIM

IPC分类号： H01L33/62 ,  H01L33/42 ,  H01L25/075 ,  H01L33/38 ,  H01L33/22 ,  H01L33/48 ,  H01L33/10

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/10 ,  H01L33/22 ,  H01L33/382 ,  H01L33/42 ,  H01L33/486

摘要： Discussed is a semiconductor light-emitting device that can include a first conductive electrode, a first conductive semiconductor layer having one surface on the first conductive electrode, and another surface on an undoped semiconductor layer, an active layer on the one surface of the first conductive semiconductor layer, a second conductive semiconductor layer on the active layer, a second conductive electrode on the second conductive semiconductor layer, and a light-transmitting layer on a surface of the undoped semiconductor layer that is opposite to where the first conductive semiconductor layer is disposed with respect to the undoped semiconductor layer. The light-transmitting layer can include a material having electrical conductivity.

公开(公告)号：US20220416125A1

公开(公告)日：2022-12-29

申请号：US17763050

申请日：2019-09-25

申请人： LG ELECTRONICS INC.

发明人： Jina JEON ,  Yongdae KIM ,  Myoungsoo KIM ,  Yoonchul KIM ,  Jungsub KIM ,  Sunghyun MOON ,  Yeonhong JUNG

IPC分类号： H01L33/38 ,  H01L33/00 ,  H01L33/62 ,  H01L25/075

摘要： Discussed is a manufacturing method of a display apparatus, and the display apparatus. The display includes a substrate, an adhesive layer located on the substrate and including protruding portions, semiconductor light-emitting diodes located on the adhesive layer, an insulating layer located on the semiconductor light-emitting diodes and the adhesive layer, and wiring electrodes electrically connected to the semiconductor light-emitting diodes, wherein the protruding portions of the adhesive layer are positioned at regular intervals to correspond to the shapes of the contact surfaces of the semiconductor light-emitting diodes in contact with the adhesive layer.

公开(公告)号：US20220077122A1

公开(公告)日：2022-03-10

申请号：US17530155

申请日：2021-11-18

申请人： LG ELECTRONICS INC.

发明人： Changseo PARK ,  Jinhyung LEE ,  Jungsub KIM ,  Seongmin MOON ,  Younho HEO

IPC分类号： H01L25/075 ,  H01L33/00 ,  H01L21/683 ,  H01L33/62

摘要： Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.

公开(公告)号：US20230268456A1

公开(公告)日：2023-08-24

申请号：US18012823

申请日：2020-06-26

申请人： LG ELECTRONICS INC.

发明人： Kisu KIM ,  Jinhyung LEE ,  Gunho KIM ,  Jungsub KIM

IPC分类号： H01L33/00 ,  H01L33/48 ,  H01L25/075 ,  H01L33/20 ,  H01L33/16

CPC分类号： H01L33/0093 ,  H01L25/0753 ,  H01L33/16 ,  H01L33/20 ,  H01L33/483

摘要： Discussed is a substrate for manufacturing a display apparatus, and the substrate can include a base portion, pair electrodes disposed on the base portion to extend in an extension direction, a dielectric layer disposed on the base portion to cover the pair electrodes, a partition wall portion disposed on the dielectric layer, and cells defined by the partition wall portion, and arranged to overlap the pair electrodes along the extension direction of the pair electrodes. The pair electrodes are arranged at different intervals.