LIGHT EMITTING APPARATUS USING SEMICONDUCTOR LIGHT-EMITTING DEVICE

    公开(公告)号:US20220102323A1

    公开(公告)日:2022-03-31

    申请号:US17418066

    申请日:2019-10-29

    Abstract: A light emitting apparatus includes a plurality of wiring electrodes, a plurality of semiconductor light emitting devices connected between two of the plurality of wiring electrodes, and a reflection layer of metal disposed under the plurality of semiconductor light emitting devices, wherein the plurality of wiring electrodes are connected in series with each other by the plurality of semiconductor light emitting devices, and at least one of the plurality of semiconductor light emitting devices is connected between two consecutive wiring electrodes among the plurality of wiring electrodes.

    DISPLAY DEVICE
    7.
    发明申请

    公开(公告)号:US20250081696A1

    公开(公告)日:2025-03-06

    申请号:US18727264

    申请日:2022-01-14

    Abstract: The display device can include a substrate, a first assembling wiring on the substrate, a second assembling wiring on the first assembling wiring, an insulating layer between the first assembling wiring and the second assembling wiring, a partition wall disposed on the second assembling wiring and having an assembly hole, and a semiconductor light-emitting device in the assembly hole. A part of the second assembling wiring can be disposed at a center of the assembly hole, and a width of a part of the second assembling wiring can be smaller than a diameter of the assembly hole.

    DISPLAY DEVICE INCLUDING A SEMICONDUCTOR LIGHT EMITTING DEVICE

    公开(公告)号:US20230138336A1

    公开(公告)日:2023-05-04

    申请号:US17978781

    申请日:2022-11-01

    Abstract: A display device according to an embodiment can include a first assembly electrode and a second assembly electrode disposed to be spaced apart from each other on a substrate, a first insulating layer disposed on the first assembly electrode and the second assembly electrode, a semiconductor light emitting device having an assembly barrier wall including a predetermined assembly hole and disposed on the first insulating layer, a side electrode electrically connected to a first side surface of the semiconductor light emitting device, and a second panel electrode electrically connected to the second conductivity type semiconductor layer.

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