FLEXIBLE CIRCUIT BOARD FOR ALL-IN-ONE CHIP ON FILM, CHIP PACKAGE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME

    公开(公告)号:US20210045229A1

    公开(公告)日:2021-02-11

    申请号:US16614192

    申请日:2018-05-09

    Abstract: A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.

    CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF
    2.
    发明申请
    CARRIER TAPE FOR TAB-PACKAGE AND MANUFACTURING METHOD THEREOF 有权
    用于包装及其制造方法的载体带

    公开(公告)号:US20140151093A1

    公开(公告)日:2014-06-05

    申请号:US14175137

    申请日:2014-02-07

    Abstract: The present invention relates to a method for manufacturing a TAB tap. The method includes forming a circuit pattern region having input/output terminal pattern on a base film, and forming an exposing region at a convey region having a sprocket hole for exposing the base film. Accordingly, the present invention provides a TAB tape that improves reliability of a product by fundamentally preventing the generation of metal particles by forming exposing regions that expose a base film through selectively etching and removing a metal layer of a convey region formed at both side of a TAB tape and having a sprocket hole, and that prevents short-circuit by partially removing a base film at a predetermined region not having a circuit pattern formed thereon through etching.

    Abstract translation: 本发明涉及一种制造TAB龙头的方法。 该方法包括在基膜上形成具有输入/输出端子图案的电路图案区域,并且在具有用于露出基底膜的链轮孔的输送区域处形成曝光区域。 因此,本发明提供一种TAB带,其通过基本上防止金属颗粒的产生而形成暴露区域,从而通过选择性地蚀刻和去除在 TAB带,并且具有链轮孔,并且通过在不具有通过蚀刻形成在其上的电路图案的预定区域部分地去除基底膜来防止短路。

    FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISING THE SAME

    公开(公告)号:US20240057259A1

    公开(公告)日:2024-02-15

    申请号:US18384415

    申请日:2023-10-27

    Abstract: A flexible printed circuit board according to an embodiment includes: a substrate; and a circuit pattern disposed on the substrate, wherein the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of third circuit patterns, wherein the third circuit pattern includes a third-first pad portion, a third-second pad portion, and a third wiring portion connecting the third-first pad portion and the third-second pad portion, a plurality of fourth wiring portions are disposed between a plurality of third wiring portions, a line width of the third wiring portion is greater than a line width of the fourth wiring portion, and a distance between the third wiring portion and the fourth wiring portion adjacent to the third wiring portion is greater than a distance between the fourth wiring portions.

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