公开(公告)号：US20200083670A1

公开(公告)日：2020-03-12

申请号：US16469968

申请日：2017-12-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Baek Jun KIM ,  Ho Jae KANG ,  Keon Hwa LEE ,  Yong Gyeong LEE

IPC: H01S5/183 ,  H01S5/022

Abstract: Embodiments relate to a semiconductor device, an optical transmission module, and an optical transmission apparatus. An optical transmission module according to an embodiment includes a board; a submount disposed on a first surface of the board; a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a first surface of the submount; and a module housing including a coupling unit and a body, the coupling unit spaced apart from the vertical cavity surface emitting laser (VCSEL) semiconductor device and facing the first surface of the submount, the body extending from the coupling unit toward the first surface of the board and disposed around the submount and the vertical cavity surface emitting laser (VCSEL) semiconductor device.

公开(公告)号：US20210234335A1

公开(公告)日：2021-07-29

申请号：US17054937

申请日：2019-05-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Myung Sub KIM ,  Baek Jun KIM ,  Ho Jae KANG ,  Ju Young PARK ,  Ba Ro LEE

IPC: H01S5/0236 ,  H01S5/183 ,  H01S5/02257

Abstract: The embodiment relates to a surface emitting laser package and a light emitting device including the same.
The surface-emitting laser package according to the embodiment may include a housing including a cavity, a surface-emitting laser device disposed in the cavity, and a diffusion unit disposed on the housing. The diffusion unit may include a polymer layer and a glass layer disposed on the polymer layer. The polymer layer may include a first polymer layer vertically overlapping the surface emitting laser device, and a second polymer layer not vertically overlapping the surface emitting laser device. The thickness of the first polymer layer may be thinner than the thickness of the second polymer layer.

公开(公告)号：US20200036161A1

公开(公告)日：2020-01-30

申请号：US16465461

申请日：2017-12-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Baek Jun KIM ,  Ho Jae KANG ,  Hui Seong KANG ,  Keon Hwa LEE ,  Yong Gyeong LEE

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/183

Abstract: Embodiments pertain to a semiconductor device package, a method of manufacturing the semiconductor device package, and an autofocusing apparatus including the semiconductor device package. The semiconductor device package according to an embodiment may include: a package body; a diffusion unit; and a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a support and under the diffusion unit. According to the embodiment, the package body may include the support, a first sidewall protruding to a first thickness from an edge region of an upper surface of the support and having a first upper surface of a first width, and a second sidewall protruding to a second thickness from the first upper surface of the first side wall and having a second upper surface of a second width, wherein the support, the first sidewall, and the second sidewall may be integrally formed with the same material. The diffusion unit may be disposed on the first upper surface of the first sidewall and may be disposed to be surrounded by the second sidewall.