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    SEMICONDUCTOR DEVICE
    1.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20190386189A1

    公开(公告)日：2019-12-19

    申请号：US16476773

    申请日：2018-01-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Keon Hwa LEE ,  Su Ik PARK ,  Yong Gyeong LEE ,  Baek Jun KIM ,  Myung Sub KIM

    IPC: H01L33/60 ,  H01L33/30 ,  H01L33/40

    Abstract: A semiconductor device according to an embodiment may include a plurality of light emitting structures, a first electrode disposed around the plurality of light emitting structures, a second electrode disposed on an upper surface of the plurality of light emitting structures, a first bonding pad electrically connected to the first electrode, and a second bonding pad electrically connected to the second electrode. The plurality of light emitting structures may include a first light emitting structure that includes a first DBR layer of a first conductivity type, a first active layer disposed on the first DBR layer, and a second DBR layer of a second conductivity type disposed on the first active layer; and a second light emitting structure that includes a third DBR layer of the first conductivity type, a second active layer disposed on the third DBR layer, and a fourth DBR layer of the second conductivity type disposed on the second active layer. The first electrode may be electrically connected to the first DBR layer and the third DBR layer, and disposed between the first light emitting structure and the second light emitting structure. The second electrode may be electrically connected to the second DBR layer and the fourth DBR layer, and disposed on an upper surface of the second DBR layer and an upper surface of the fourth DBR layer.

    OPTICAL TRANSMISSION MODULE
    2.
    发明申请
    OPTICAL TRANSMISSION MODULE 审中-公开

    公开(公告)号：US20200083670A1

    公开(公告)日：2020-03-12

    申请号：US16469968

    申请日：2017-12-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Baek Jun KIM ,  Ho Jae KANG ,  Keon Hwa LEE ,  Yong Gyeong LEE

    IPC: H01S5/183 ,  H01S5/022

    Abstract: Embodiments relate to a semiconductor device, an optical transmission module, and an optical transmission apparatus. An optical transmission module according to an embodiment includes a board; a submount disposed on a first surface of the board; a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a first surface of the submount; and a module housing including a coupling unit and a body, the coupling unit spaced apart from the vertical cavity surface emitting laser (VCSEL) semiconductor device and facing the first surface of the submount, the body extending from the coupling unit toward the first surface of the board and disposed around the submount and the vertical cavity surface emitting laser (VCSEL) semiconductor device.

    SURFACE EMITTING LASER PACKAGE AND LIGHT EMITTING DEVICE COMPRISING SAME
    5.
    发明申请
    SURFACE EMITTING LASER PACKAGE AND LIGHT EMITTING DEVICE COMPRISING SAME 有权

    公开(公告)号：US20210234335A1

    公开(公告)日：2021-07-29

    申请号：US17054937

    申请日：2019-05-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Myung Sub KIM ,  Baek Jun KIM ,  Ho Jae KANG ,  Ju Young PARK ,  Ba Ro LEE

    IPC: H01S5/0236 ,  H01S5/183 ,  H01S5/02257

    Abstract: The embodiment relates to a surface emitting laser package and a light emitting device including the same.
    The surface-emitting laser package according to the embodiment may include a housing including a cavity, a surface-emitting laser device disposed in the cavity, and a diffusion unit disposed on the housing. The diffusion unit may include a polymer layer and a glass layer disposed on the polymer layer. The polymer layer may include a first polymer layer vertically overlapping the surface emitting laser device, and a second polymer layer not vertically overlapping the surface emitting laser device. The thickness of the first polymer layer may be thinner than the thickness of the second polymer layer.

    SURFACE-EMITTING LASER PACKAGE
    6.
    发明申请
    SURFACE-EMITTING LASER PACKAGE 审中-公开

    公开(公告)号：US20200220324A1

    公开(公告)日：2020-07-09

    申请号：US16633889

    申请日：2018-08-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ba Ro LEE ,  Myung Sub KIM ,  Baek Jun KIM ,  Ki Bum SUNG

    IPC: H01S5/022 ,  H01S5/10 ,  H01S5/42

    Abstract: A surface-emitting laser package comprises: a substrate; a surface-emitting laser device disposed on the substrate, and having a non-emitting area and an emitting area which includes a plurality of emitters each generating a first laser beam; a housing disposed around the surface-emitting laser device; and a diffusing part disposed on the surface-emitting laser device. The emitting area has a first width in a first direction and a second width in a second direction perpendicular to the first direction, and the second width may be greater than the first width. The diffusing part outputs the first laser beam into a second laser beam having a first angle of view in the first direction and a second angle of view in the second direction, and the first angle of view may be greater than the second angle of view.

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR PRODUCING SAME
    7.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR PRODUCING SAME 审中-公开

    公开(公告)号：US20200036161A1

    公开(公告)日：2020-01-30

    申请号：US16465461

    申请日：2017-12-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Baek Jun KIM ,  Ho Jae KANG ,  Hui Seong KANG ,  Keon Hwa LEE ,  Yong Gyeong LEE

    IPC: H01S5/024 ,  H01S5/022 ,  H01S5/183

    Abstract: Embodiments pertain to a semiconductor device package, a method of manufacturing the semiconductor device package, and an autofocusing apparatus including the semiconductor device package. The semiconductor device package according to an embodiment may include: a package body; a diffusion unit; and a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a support and under the diffusion unit. According to the embodiment, the package body may include the support, a first sidewall protruding to a first thickness from an edge region of an upper surface of the support and having a first upper surface of a first width, and a second sidewall protruding to a second thickness from the first upper surface of the first side wall and having a second upper surface of a second width, wherein the support, the first sidewall, and the second sidewall may be integrally formed with the same material. The diffusion unit may be disposed on the first upper surface of the first sidewall and may be disposed to be surrounded by the second sidewall.

    LIGHT EMITTING DEVICE AND LIGHTING SYSTEM
    8.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHTING SYSTEM 有权
    发光装置和照明系统

    公开(公告)号：US20160181479A1

    公开(公告)日：2016-06-23

    申请号：US14978741

    申请日：2015-12-22

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Baek Jun KIM ,  Hiroshi KODAIRA ,  Ki Man KANG ,  Ha Na KIM ,  Hyun Don SONG ,  Jung Woo LEE ,  Jung Hun OH

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/58

    CPC classification number: H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2933/0058 ,  H01L2924/00014

    Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.

    Abstract translation: 一种发光器件包括具有空腔的腔体和围绕空腔的台阶差分结构，空腔中的多个电极，空腔中的发光芯片，具有设置在台阶差分结构上的外部部分的透明窗口以覆盖 空腔和透明窗与主体之间的粘合构件。 所述粘合部件包括在所述透明窗的外底表面和所述台阶差结构的底部之间的第一粘合构件，以及在所述透明窗的外部与所述主体之间的第二粘合构件。

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