公开(公告)号：US20230217593A1

公开(公告)日：2023-07-06

申请号：US17927797

申请日：2021-05-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Il Sik NAM ,  Dong Keun LEE ,  Hye Jin JO

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/115 ,  H01L21/486 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L23/49827 ,  H05K1/186 ,  H05K1/0271 ,  H05K3/3415 ,  H05K3/4007 ,  H05K3/4697 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/11462 ,  H01L2224/11912 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2203/0723

Abstract: A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact portion disposed on the first connection portion; a first device disposed on the first connection portion through the first contact portion; a second contact portion disposed under a lower surface of a second-first circuit pattern of the second outer circuit pattern; a second device attached to the second-first circuit pattern through the second contact portion; and a second connection portion disposed under a lower surface of a second-second circuit pattern of the second outer circuit pattern; wherein the first connection portion is disposed with a first width and a first interval, and wherein the second connection portion is disposed with a second width greater than the first width and a second interval greater than the first interval.

公开(公告)号：US20220338346A1

公开(公告)日：2022-10-20

申请号：US17638898

申请日：2020-08-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Il Sik NAM ,  Yong Suk KIM ,  Dong Keun LEE ,  Tae Ki KIM ,  Hye Jin JO

IPC: H05K1/11 ,  H05K1/02

Abstract: A printed circuit board according to an embodiment includes an insulating layer; a first pad disposed on an upper surface of the insulating layer; a second pad disposed on a lower surface of the insulating layer; a first device mounted on the first pad; a second device mounted on the second pad; a first molding layer disposed on the insulating layer and molding the first device; and a second molding layer disposed on the lower surface of the insulating layer and molding the second device, wherein a lower surface of the second molding layer is positioned on the same plane as a lower surface of the second device.