公开(公告)号：US10381519B2

公开(公告)日：2019-08-13

申请号：US15550955

申请日：2016-03-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Won Seo ,  Hoe Jun Kim ,  Bum Jin Yim ,  Jun Hee Hong

IPC: H01L33/44 ,  H01L33/62 ,  H01L33/38 ,  H01L33/32 ,  H01L33/40 ,  H01L33/14

Abstract: A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the through-hole.

公开(公告)号：US10586892B2

公开(公告)日：2020-03-10

申请号：US15770158

申请日：2016-10-21

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Hee Hong ,  Deok Ki Hwang ,  Hoe Jun Kim ,  Woo Sik Lim

IPC: H01L33/36 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62 ,  H01L33/48 ,  H01L33/38

Abstract: One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

公开(公告)号：US10388830B2

公开(公告)日：2019-08-20

申请号：US15506801

申请日：2015-07-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Jin Kyung Choi ,  Jun Hee Hong ,  Sang Youl Lee

IPC: H01L33/12 ,  H01L33/20 ,  H01L33/40 ,  H01L33/52 ,  H01L33/62 ,  H01L33/50

Abstract: A light emitting device package according to an embodiment comprises: a light emitting device comprising a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second lead frames disposed to be spaced apart from each other; first and second solder portions disposed on the first and second lead frames, respectively; and first and second pads disposed between the first and second solder portions and the first and second conductive semiconductor layers, respectively, wherein at least one of the first or second pad comprises at least one of a rounding portion and a chamfer portion, wherein the first pad comprises a first-first edge and a first-second edge being positioned farther than the first-first edge from the center of the light emitting device, wherein the second pad comprises a second-first edge and a second-second edge being positioned farther than the second-first edge from the center of the light emitting device, and wherein the rounding portion or the chamfer portion is positioned at at least one of the first-second edge or the second-second edge.