IMAGE SENSOR PACKAGE AND CAMERA DEVICE COMPRISING SAME

    公开(公告)号:US20230276112A1

    公开(公告)日:2023-08-31

    申请号:US18014626

    申请日:2021-05-06

    Abstract: An image sensor package, according to one embodiment of the present invention, comprises: a printed circuit board; an image sensor disposed on the printed circuit board; a first support part disposed on the image sensor; a filter layer disposed on the image sensor; a second support part disposed on the printed circuit board, to the side of the image sensor; a wire part which is disposed between the first support part and the second support part, and of which one end is connected to the image sensor and the other end is connected to the printed circuit board; and a molding member filling the gap between the first support part and the second support part.

    IMAGE SENSOR PACKAGE AND CAMERA DEVICE INCLUDING SAME

    公开(公告)号:US20230171874A1

    公开(公告)日:2023-06-01

    申请号:US17922632

    申请日:2021-05-06

    CPC classification number: H05K1/0206 H04N23/50 H05K1/113

    Abstract: A camera device according to one embodiment of the present invention includes a printed circuit board, a heat radiation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat radiation layer, a plurality of through-holes passing through the printed circuit board from the first surface to a second surface which is a surface opposite to the first surface are formed in the printed circuit board, and the plurality of through-holes are in contact with the heat radiation layer.

Patent Agency Ranking