公开(公告)号：US12030138B2

公开(公告)日：2024-07-09

申请号：US17642617

申请日：2020-09-11

Applicant: LIFCO INDUSTRIE

Inventor： Constantin Iacob ,  Sébastien Bucher

IPC: B23K35/02 ,  B23K35/30 ,  H05K1/02 ,  H05K3/34

CPC classification number: B23K35/0222 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  H05K1/0271 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10734 ,  H05K2203/0435

Abstract: The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter D0 made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.