公开(公告)号：US06330967B1

公开(公告)日：2001-12-18

申请号：US08815656

申请日：1997-03-13

Applicant: Joseph M. Milewski ,  Charles G. Woychik

Inventor： Joseph M. Milewski ,  Charles G. Woychik

IPC: B23K3102

CPC classification number: H01L24/81 ,  B23K31/02 ,  B23K35/268 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/0435 ,  H05K2203/1105 ,  Y02P70/613

Abstract: A solder interconnection uses preferably lead-rich solder balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a thin cap layer of preferably pure tin is deposited on a surface of the solder balls. An interconnecting eutectic alloy is formed upon reflow. Subsequent annealing causes tin to diffuse into the lead, or vice versa, and intermix, thereby raising the melting point temperature of the cap layer of the resulting assembly. This structure and process avoids secondary reflow problems during subsequent processing.

Abstract translation: 焊料互连优选地使用富铅焊料球，以将低温芯片附接到任何更高级别的封装衬底上。 在使用标准工艺形成焊球之后，在焊料球的表面上沉积优选纯锡的薄盖层。 在回流时形成互连共晶合金。 随后的退火使锡扩散到引线中，反之亦然，并且混合，从而提高所得组件的盖层的熔点温度。 该结构和工艺在后续处理中避免了二次回流问题。

公开(公告)号：US5953623A

公开(公告)日：1999-09-14

申请号：US835690

申请日：1997-04-10

Applicant: Christina M. Boyko ,  Anthony P. Ingraham ,  Voya R. Markovich ,  David J. Russell

Inventor： Christina M. Boyko ,  Anthony P. Ingraham ,  Voya R. Markovich ,  David J. Russell

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L21/44

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H05K3/3436 ,  H01L2224/13 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K2203/0435 ,  H05K2203/073 ,  H05K3/3463 ,  Y02P70/613

Abstract: A solder interconnection uses preferably lead-rich balls for making a low temperature chip attachment directly to any of the higher levels of packaging substrate. After a solder ball has been formed using standard processes, a ball limiting metal mask is formed using photoresist. A thin cap layer of preferably pure tin is deposited on a surface of the solder balls using a tin aqueous immersion process.

Abstract translation: 焊料互连优选地使用富铅球，以将低温芯片附接到任何更高级别的封装衬底上。 在使用标准工艺形成焊球之后，使用光致抗蚀剂形成球限制金属掩模。 使用锡水溶液浸渍法将优选纯锡的薄盖层沉积在焊球的表面上。

公开(公告)号：US5865365A

公开(公告)日：1999-02-02

申请号：US761430

申请日：1996-12-06

Applicant: Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

Inventor： Toru Nishikawa ,  Ryohei Satoh ,  Masahide Hara ,  Tetsuya Hayashida ,  Mitugu Shirai ,  Osamu Yamada ,  Hiroko Takehara ,  Yasuhiro Iwata ,  Mitsunori Tamura ,  Masahito Ijuin

IPC: B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L24/12 ,  B23K1/0016 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H05K3/3489 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426

Abstract: A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination layers present on the surface of presoldered portions or metallized bonding portions. By this method, fluxless soldering is performed, positional shifts are reduced, and high reliability of the soldering connections with reduction in residues after reflow are obtained.

Abstract translation: 用于制造电子电路器件的焊接方法使用供应至待接合的至少一个连接部件的有机材料。 连接构件位于氧化气氛中，并在非氧化气氛中加热以除去存在于预制部分或金属化粘合部分的表面上的氧化物和/或污染层。 通过该方法，进行无焊剂焊接，位移偏移降低，并且获得了在回流之后具有减少残留物的焊接连接的高可靠性。

公开(公告)号：US5641990A

公开(公告)日：1997-06-24

申请号：US512024

申请日：1995-08-07

Applicant: George W. Chiu

Inventor： George W. Chiu

IPC: B23K35/00 ,  B23K35/26 ,  H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48

CPC classification number: H05K3/3436 ,  B23K35/001 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  B23K35/26 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method for forming solder balls and an apparatus and method for forming solder columns on the electrical contact pads of an electronic package in order to establish a more reliable electrical and mechanical connection between an electronic package and a printed circuit board. In one embodiment, solder balls are formed on the electrical contact pads of a package by placing solder cylinders over the electrical contact pads and then passing the package through a reflow furnace where the solder cylinders take the form of spheres and are wetted onto the pads. In a second embodiment, a laminated solder column is formed that is resistant to collapse during the manufacturing process. The laminated solder column comprises a solder cylinder being clad on its top and bottom surfaces with a solder material having a lower melting temperature than that of the center solder cylinder. When attaching the solder column to a package or a printed circuit board reflow temperatures are maintained above the melting temperature of the cladding material but below the melting temperature of the center solder cylinder such that the cladding is wetted onto the electrical contact pads of the package or printed circuit board while the center solder cylinder maintains its solid form.

Abstract translation: 一种用于形成焊球的方法，以及用于在电子封装的电接触焊盘上形成焊料柱的装置和方法，以便在电子封装和印刷电路板之间建立更可靠的电气和机械连接。 在一个实施例中，通过将焊料圆柱放置在电接触焊盘上，然后使封装穿过回流焊炉，焊料圆筒呈球形并被润湿到焊盘上，在焊料的电接触焊盘上形成焊球。 在第二实施例中，形成层压的焊料柱，其在制造过程中耐塌陷。 层压焊料柱包括在其顶表面和底表面上包覆焊料圆筒的焊料料，其熔化温度低于中心焊料圆筒的熔化温度。 当将焊料柱连接到封装或印刷电路板时，回流温度保持在包层材料的熔化温度以上但低于中心焊料圆筒的熔化温度，使得包层被润湿到包装的电接触焊盘上，或者 印刷电路板，而中心焊锡圆筒保持其固体形式。

公开(公告)号：US5516031A

公开(公告)日：1996-05-14

申请号：US235909

申请日：1994-05-02

Applicant: Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

Inventor： Toru Nishikawa ,  Masahito Ijuin ,  Ryohei Sato ,  Mitsugu Shirai

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/20 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K3/34 ,  B23K3/08

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/206 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/75 ,  H05K3/3436 ,  H05K3/3489 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/742 ,  H01L2224/75 ,  H01L2224/75272 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/10984 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/0435 ,  H05K2203/086 ,  H05K2203/087 ,  H05K2203/095 ,  H05K2203/1157 ,  H05K3/3426 ,  Y02P70/613

Abstract: In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Abstract translation: 为了通过无焊接方法及其设备通过溅射蚀刻来对应于其通过溅射蚀刻的焊接和焊接材料的焊接材料的焊接和焊接材料上的氧化膜和污染膜去除氧化物膜和污染膜，在溅射蚀刻下从焊料材料发射的物质使用 检测并确定原子或离子是来自焊料材料还是来自其上的氧化物膜。 基于去除氧化膜的测定来控制溅射蚀刻。 然后，将构件在氧化气氛中排列并在非氧化气氛中焊接。

公开(公告)号：US5409157A

公开(公告)日：1995-04-25

申请号：US207321

申请日：1994-03-07

Applicant: Voddarahalli K. Nagesh ,  Daniel J. Miller ,  Robert A. Schuchard ,  Jeffrey G. Hargis

Inventor： Voddarahalli K. Nagesh ,  Daniel J. Miller ,  Robert A. Schuchard ,  Jeffrey G. Hargis

IPC: H01L23/12 ,  B23K1/00 ,  H01L23/498 ,  H01R4/02 ,  H05K3/34 ,  H01L21/44 ,  H01L21/58

CPC classification number: B23K1/0016 ,  H01L23/49816 ,  H01R4/02 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H01L2924/00013 ,  H05K2201/10234 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/24826 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

Abstract translation: 用于微载体的复合横向塑料互连产生具有低电阻和高机械强度，显着的键高度以介导不同载体和衬底材料之间的TCE失配以及载体和衬底之间的足够间隙的载体与衬底粘合，以允许 有效的后焊料清洗互连。 由焊球组成的接触阵列直接放置在载体或衬底互连表面中的任一个上，并且模板位于所选择的互连表面。 焊球可具有选定的熔化温度。 此外，焊球可以具有诸如镍或铜的金属涂层或熔融焊料。 载体和基底通过配合每个的互连表面并施加热量来连接。 可以将焊膏施加到互连表面中的一个以增加接头的附加高度并补偿载体和基底之间的共面性的缺乏。

公开(公告)号：US5320272A

公开(公告)日：1994-06-14

申请号：US42227

申请日：1993-04-02

Applicant: Cynthia Melton ,  Harry Fuerhaupter ,  George Demet

Inventor： Cynthia Melton ,  Harry Fuerhaupter ,  George Demet

IPC: B23K35/00 ,  B23K35/26 ,  H05K3/24 ,  H05K3/34

CPC classification number: H05K3/3484 ,  B23K35/007 ,  B23K35/264 ,  H05K3/3463 ,  H05K2201/0317 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/0435 ,  H05K2203/054 ,  H05K3/243 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3473 ,  Y02P70/611

Abstract: In an electronic package, a solder connection for bonding faying surfaces is formed of tin-bismuth alloy comprising a tertiary metal, preferably gold or silver, in an amount effective to increase the melting temperature of the alloy and enhance mechanical properties of the connection at elevated temperatures typically encountered during operation. A process for forming the solder connection comprises applying a film of the tertiary metal onto at least one faying surface and thereafter applying tin-bismuth solder paste onto the film. Preferably, a plate of tin-bismuth alloy is first electroplated onto the faying surface, onto which the tertiary metal is plated. During heating to reflow the solder, the tertiary metal dissolves to produce a uniform liquid that forms the connection.

Abstract translation: 在电子封装中，用于焊接接合表面的焊接连接由含有第三金属，优选金或银的锡 - 铋合金形成，其量有效地增加合金的熔融温度并增强连接处的升高的机械性能 操作中通常遇到的温度。 用于形成焊接连接​​的工艺包括将第三金属的膜施加到至少一个引线表面上，然后将锡 - 铋焊膏施加到膜上。 优选地，将锡 - 铋合金板首先电镀在第三金属被电镀的引线表面上。 在加热回流焊料期间，第三金属溶解以产生形成连接的均匀液体。

公开(公告)号：US5296649A

公开(公告)日：1994-03-22

申请号：US852526

申请日：1992-03-17

Applicant: Izumi Kosuga ,  Kenichi Fuse ,  Takao Fukunaga ,  Hirokazu Shiroishi ,  Masanao Kohno ,  Hisao Irie

Inventor： Izumi Kosuga ,  Kenichi Fuse ,  Takao Fukunaga ,  Hirokazu Shiroishi ,  Masanao Kohno ,  Hisao Irie

IPC: B23K35/02 ,  B23K35/34 ,  H05K1/11 ,  H05K3/34 ,  H05K01/00

CPC classification number: H05K3/3484 ,  B23K35/0222 ,  B23K35/34 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/0435 ,  H05K3/3421 ,  H05K3/3452 ,  Y02P70/611

Abstract: A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

Abstract translation: 在电路板主体上以0.5mm以下的间距形成多个焊盘。 焊盘形成为使得来自板体表面的焊盘的突出高度H和焊盘的宽度W满足关系2H D。 通过在构成焊料层的金属中的离子化倾向最高的金属粉末或其合金粉末之间的取代反应和通过将焊料层中的其它金属或金属接合而形成的盐而获得的焊料层为 有机酸形成在每个垫上。

公开(公告)号：US4606962A

公开(公告)日：1986-08-19

申请号：US739508

申请日：1985-05-31

Applicant: Robert S. Reylek ,  Kenneth C. Thompson

Inventor： Robert S. Reylek ,  Kenneth C. Thompson

IPC: H01L21/58 ,  H01L23/373 ,  H05K3/32 ,  B32B5/00

CPC classification number: H05K3/323 ,  C09J11/04 ,  C09J7/00 ,  C09J9/02 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3737 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  C08K3/08 ,  C08K7/18 ,  C09J2203/326 ,  C09J2205/102 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27436 ,  H01L2224/29076 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L24/32 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0218 ,  H05K2201/09945 ,  H05K2203/0156 ,  H05K2203/0425 ,  H05K2203/0435 ,  H05K2203/066 ,  Y10T156/1052 ,  Y10T29/4913 ,  Y10T428/24413 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24843 ,  Y10T428/24893 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2887 ,  Y10T428/2891

Abstract: The adhesive layer of the novel transfer tape contains electrically and thermally conductive particles such as silver which are preferably spherical and are larger than the thickness of the adhesive between particles. When used to bond two rigid substrates together, pressure is applied to the substrates to flatten the particles to the thickness of the adhesive between particles, thus making good electrical and thermal connection between the substrates through each particle.

Abstract translation: 新型转移带的粘合剂层包含优选为球形并且比颗粒之间的粘合剂的厚度大的导热性导电颗粒，例如银。 当将两个刚性基板粘合在一起时，将压力施加到基板上以将颗粒平坦化到颗粒之间的粘合剂的厚度，从而通过每个颗粒在基板之间形成良好的电和热连接。

公开(公告)号：US08344522B2

公开(公告)日：2013-01-01

申请号：US12935864

申请日：2009-03-18

Applicant: Hideki Mizuhara ,  Hajime Kobayashi ,  Toshiya Shimizu

Inventor： Hideki Mizuhara ,  Hajime Kobayashi ,  Toshiya Shimizu

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: B23K1/0016 ,  B23K31/02 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/42 ,  B32B15/018 ,  C22C13/00 ,  C22C13/02 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3463 ,  H05K2203/0435 ,  H01L2924/00

Abstract: The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm.

Abstract translation: 本发明提供一种不太可能开发Sn晶须的焊料结构和形成这种焊料结构的方法。 焊料结构包括能够具有固液共存状态的Sn合金和覆盖Sn合金表面的至少一部分的Au（或Au合金）涂层。 Au覆盖层是覆盖并涂覆Sn合金表面的至少一部分的膜。 作为优选的方式，Au涂层在Sn合金的表面上形成网状结构。 Au涂层的厚度例如为1〜5μm。