-
公开(公告)号：US20140335560A1
公开(公告)日：2014-11-13
申请号：US14275812
申请日：2014-05-12
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. BAER , Michael G. YOUNGQUIST , Brian W. DONOVAN , Alan E. WESSEL , Norbert H. LECLERC , Michael A. SMITH , Craig S. BARKER , George M. DAWSON
CPC classification number: G01N1/2813 , G01B11/002 , G01N2001/282 , G01N2001/284 , Y10T156/10 , Y10T156/1054
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
Abstract translation: 公开了用于自动激光显微切割的系统和方法，包括自动滑动检测，切割和捕获激光器的位置检测，用于切割和捕获激光器的聚焦优化，用于切割和捕获激光器的能量和持续时间优化，检查和第二相捕获和/或消融 质量控制站和用于将衬底载体或输出显微切割区域与输入样品或载片连接的跟踪信息。
-
公开(公告)号：US20170284907A1
公开(公告)日：2017-10-05
申请号：US15434200
申请日：2017-02-16
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. Baer , Michael G. YOUNGQUIST , Brian W. DONOVAN , Alan E. WESSEL , Norbert H. LECLERC , Michael A. SMITH , Craig S. BARKER , George M. DAWSON
CPC classification number: G01N1/2813 , G01B11/002 , G01N2001/282 , G01N2001/284 , Y10T156/10 , Y10T156/1054
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
公开(公告)号：US20190120734A1
公开(公告)日：2019-04-25
申请号：US16208557
申请日：2018-12-03
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. BAER , Michael G. YOUNGQUIST , Brian W. DONOVAN , Alan E. WESSEL , Norbert H. LECLERC , Michael A. SMITH , Craig S. BARKER , George M. DAWSON
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
-
Search Results
3
records
(took 0.013 seconds)
