-
公开(公告)号：US10156501B2
公开(公告)日：2018-12-18
申请号：US15434200
申请日：2017-02-16
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. Baer , Michael G. Youngquist , Brian W. Donovan , Alan E. Wessel , Norbert H. Leclerc , Michael A. Smith , Craig S. Barker , George M. Dawson
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
Patent Agency Ranking
公开(公告)号：US11703428B2
公开(公告)日：2023-07-18
申请号：US17516605
申请日：2021-11-01
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. Baer , Michael G. Youngquist , Brian W. Donovan , Alan E. Wessel , Norbert H. Leclerc , Michael A. Smith , Craig S. Barker , George M. Dawson
CPC classification number: G01N1/2813 , G01B11/002 , G01N2001/282 , G01N2001/284 , Y10T156/10 , Y10T156/1054
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
公开(公告)号：US11175203B2
公开(公告)日：2021-11-16
申请号：US16790595
申请日：2020-02-13
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. Baer , Michael G. Youngquist , Brian W. Donovan , Alan E. Wessel , Norbert H. Leclerc , Michael A. Smith , Craig S. Barker , George M. Dawson
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
公开(公告)号：US20220113229A1
公开(公告)日：2022-04-14
申请号：US17516605
申请日：2021-11-01
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. Baer , Michael G. Youngquist , Brian W. Donovan , Alan E. Wessel , Norbert H. Leclerc , Michael A. Smith , Craig S. Barker , George M. Dawson
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
公开(公告)号：US20200284702A1
公开(公告)日：2020-09-10
申请号：US16790595
申请日：2020-02-13
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. BAER , Michael G. Youngquist , Brian W. Donovan , Alan E. Wessel , Norbert H. Leclerc , Michael A. Smith , Craig S. Barker , George M. Dawson
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
公开(公告)号：US10605706B2
公开(公告)日：2020-03-31
申请号：US16208557
申请日：2018-12-03
Applicant: LIFE TECHNOLOGIES CORPORATION
Inventor： Thomas M. Baer , Michael G. Youngquist , Brian W. Donovan , Alan E. Wessel , Norbert H. Leclerc , Michael A. Smith , Craig S. Barker , George M. Dawson
Abstract: Systems and methods for automated laser microdissection are disclosed including automatic slide detection, position detection of cutting and capture lasers, focus optimization for cutting and capture lasers, energy and duration optimization for cutting and capture lasers, inspection and second phase capture and/or ablation in a quality control station and tracking information for linking substrate carrier or output microdissected regions with input sample or slide.
-
-
-
-
-
Search Results
6
records
(took 0.015 seconds)
