PACKAGE STRUCTURE OF OPTICAL TRANSCEIVER COMPONENT
    1.
    发明申请
    PACKAGE STRUCTURE OF OPTICAL TRANSCEIVER COMPONENT 有权
    光收发器组件的包装结构

    公开(公告)号:US20140239315A1

    公开(公告)日:2014-08-28

    申请号:US14183328

    申请日:2014-02-18

    IPC分类号: H01L33/48

    摘要: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

    摘要翻译: 本发明提供一种光收发器部件的封装结构,包括:金属基座; 多个引脚,至少一个发光二极管和/或至少一个光接收二极管; 其中所述销被提供并通过所述金属基底并且通过使用绝缘材料与所述金属基底绝缘; 光发射二极管和光接收二极管分别通过子座安装在金属基座上。 当将发射二极管/光接收二极管的顶表面设置为基准电平时,光发射二极管/光接收二极管通过电线直接或穿过子座连接到与其相邻的引脚,发光的顶表面中的至少一个 二极管,光接收二极管和子座与基准电平齐平。