公开(公告)号：US20170236741A1

公开(公告)日：2017-08-17

申请号：US15422823

申请日：2017-02-02

Applicant: Lam Research Corporation

Inventor： Ivelin Angelov ,  Cristian Siladie ,  Dean Larson ,  Brian Severson

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01J37/3244 ,  H01J37/32082 ,  H01J37/32715 ,  H01J2237/334

Abstract: A substrate support includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller that calculates a desired pocket depth of the substrate support. Pocket depth corresponds to a distance between an upper surface of the edge ring and an upper surface of the substrate. Based on the desired pocket depth, the controller selectively controls an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.

公开(公告)号：US20200273671A1

公开(公告)日：2020-08-27

申请号：US16871829

申请日：2020-05-11

Applicant: LAM RESEARCH CORPORATION

Inventor： Ivelin ANGELOV ,  Cristian Siladie ,  Dean Larson ,  Brian Severson

IPC: H01J37/32 ,  H01J37/00

Abstract: A method of operating a substrate support includes arranging a substrate on an inner portion of the substrate support and calculating a desired pocket depth of the substrate support using data indicative of a relationship between the desired pocket depth and at least one process parameter. The desired pocket depth corresponds to a desired distance between an upper surface of an edge ring surrounding the inner portion and an upper surface of the substrate. The method further includes selectively controlling, based on the desired pocket depth as calculated, an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.

公开(公告)号：US20150024594A1

公开(公告)日：2015-01-22

申请号：US13943908

申请日：2013-07-17

Applicant: Lam Research Corporation

Inventor： Andreas Fischer ,  Dean Larson

IPC: H01L21/687 ,  H01J37/32 ,  H01L21/67 ,  H01L21/306 ,  H01L21/02

CPC classification number: H01L21/68742 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109

Abstract: A semiconductor substrate processing apparatus includes a cooled pin lifter paddle for raising and lowering a semiconductor substrate. The semiconductor substrate processing apparatus comprises a processing chamber in which the semiconductor substrate is processed, a heated pedestal for supporting the semiconductor substrate in the processing chamber, and the cooled pin lifter paddle located below the pedestal. The cooled pin lifter paddle includes a heat shield and at least one flow passage in an outer peripheral portion thereof through which a coolant can be circulated to remove heat absorbed by the heat shield of the cooled pin lifter paddle. The cooled pin lifter paddle is vertically movable such that lift pins on an upper surface of the heat shield travel through corresponding holes in the pedestal and a source of coolant is in flow communication with the at least one flow passage.

Abstract translation: 半导体基板处理装置包括用于升高和降低半导体基板的冷却引脚升降器叶片。 半导体基板处理装置包括处理半导体基板的处理室，用于将处理室中的半导体基板支撑的加热基座和位于基座下方的冷却引脚升降器叶片。 冷却的升降器桨叶包括隔热罩和至少一个在其外周部分中的流动通道，冷却剂可以通过该通道循环，以消除由冷却的升降器桨叶的隔热板吸收的热量。 冷却的销钉升降器叶片是可垂直移动的，使得热屏蔽件的上表面上的提升销穿过基座中的相应的孔并且冷却剂源与至少一个流动通道流动连通。

公开(公告)号：US11342163B2

公开(公告)日：2022-05-24

申请号：US16871829

申请日：2020-05-11

Applicant: LAM RESEARCH CORPORATION

Inventor： Ivelin Angelov ,  Cristian Siladie ,  Dean Larson ,  Brian Severson

IPC: H01J37/00 ,  H01J37/32

Abstract: A method of operating a substrate support includes arranging a substrate on an inner portion of the substrate support and calculating a desired pocket depth of the substrate support using data indicative of a relationship between the desired pocket depth and at least one process parameter. The desired pocket depth corresponds to a desired distance between an upper surface of an edge ring surrounding the inner portion and an upper surface of the substrate. The method further includes selectively controlling, based on the desired pocket depth as calculated, an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.

公开(公告)号：US10651015B2

公开(公告)日：2020-05-12

申请号：US15422823

申请日：2017-02-02

Applicant: Lam Research Corporation

Inventor： Ivelin Angelov ,  Cristian Siladie ,  Dean Larson ,  Brian Severson

IPC: H01J37/00 ,  H01J37/32

Abstract: A substrate support includes an inner portion arranged to support a substrate, an edge ring surrounding the inner portion, and a controller that calculates a desired pocket depth of the substrate support. Pocket depth corresponds to a distance between an upper surface of the edge ring and an upper surface of the substrate. Based on the desired pocket depth, the controller selectively controls an actuator to raise and lower at least one of the edge ring and the inner portion to adjust the distance between the upper surface of the edge ring and the upper surface of the substrate.

公开(公告)号：US09859145B2

公开(公告)日：2018-01-02

申请号：US13943908

申请日：2013-07-17

Applicant: Lam Research Corporation

Inventor： Andreas Fischer ,  Dean Larson

IPC: H01L21/00 ,  H01L21/687 ,  H01J37/32 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67109

Abstract: A semiconductor substrate processing apparatus includes a cooled pin lifter paddle for raising and lowering a semiconductor substrate. The semiconductor substrate processing apparatus comprises a processing chamber in which the semiconductor substrate is processed, a heated pedestal for supporting the semiconductor substrate in the processing chamber, and the cooled pin lifter paddle located below the pedestal. The cooled pin lifter paddle includes a heat shield and at least one flow passage in an outer peripheral portion thereof through which a coolant can be circulated to remove heat absorbed by the heat shield of the cooled pin lifter paddle. The cooled pin lifter paddle is vertically movable such that lift pins on an upper surface of the heat shield travel through corresponding holes in the pedestal and a source of coolant is in flow communication with the at least one flow passage.