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公开(公告)号:US20190148190A1
公开(公告)日:2019-05-16
申请号:US16247509
申请日:2019-01-14
Applicant: Lam Research Corporation
Inventor: Eric Pape , Darrell Ehrlich , Mike Jing
IPC: H01L21/67 , G01K1/14 , G01K1/02 , H01L21/683 , G01K7/00 , H01L21/673
Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.
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公开(公告)号:US20170098564A1
公开(公告)日:2017-04-06
申请号:US14874991
申请日:2015-10-05
Applicant: Lam Research Corporation
Inventor: Eric Pape , Darrell Ehrlich , Mike Jing
IPC: H01L21/67 , G01K7/00 , H01L21/673
CPC classification number: H01L21/67248 , G01K1/026 , G01K1/14 , G01K7/00 , H01L21/67103 , H01L21/67109 , H01L21/67346 , H01L21/6833
Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.
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公开(公告)号:US10978323B2
公开(公告)日:2021-04-13
申请号:US16247509
申请日:2019-01-14
Applicant: Lam Research Corporation
Inventor: Eric Pape , Darrell Ehrlich , Mike Jing
IPC: G01K7/00 , G01K1/14 , H01L21/67 , H01L21/683 , G01K1/02 , H01L21/673
Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.
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公开(公告)号:US10186437B2
公开(公告)日:2019-01-22
申请号:US14874991
申请日:2015-10-05
Applicant: Lam Research Corporation
Inventor: Eric Pape , Darrell Ehrlich , Mike Jing
IPC: H01L21/67 , G01K7/00 , H01L21/673 , H01L21/683 , G01K1/02 , G01K1/14
Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.
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