公开(公告)号：US20240363311A1

公开(公告)日：2024-10-31

申请号：US18767915

申请日：2024-07-09

申请人： Lam Research Corporation

发明人： Weiyi LUO ,  Youn Gi HONG ,  WeiWu ZHONG ,  Himanshu CHOKSHI

IPC分类号： H01J37/32 ,  C23C16/455 ,  C23C16/50 ,  C23C16/52

CPC分类号： H01J37/32183 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/50 ,  C23C16/52 ,  H01J37/3299 ,  H01J2237/332 ,  H01J2237/334

摘要： A substrate processing system includes a plasma generator configured to supply (radio frequency) RF power to an electrode arranged in a processing chamber. A sensor is configured to sense a parameter of the RF power supplied to the electrode. A controller is configured to compensate variations in a rate of a plasma process due to variations in bulk resistivity of a substrate arranged on a substrate support by causing the sensor to sense the parameter at least one of prior to plasma processing of the substrate and after a predetermined period after the plasma processing of the substrate begins; and adjusting the parameter of the RF power for the substrate during the plasma processing of the substrate based on the parameter sensed for the substrate.

公开(公告)号：US20210313152A1

公开(公告)日：2021-10-07

申请号：US17267525

申请日：2019-08-08

申请人： LAM RESEARCH CORPORATION

发明人： Wei Yi LUO ,  Youn Gi HONG ,  WeiWu ZHONG ,  Himanshu CHOKSHI

IPC分类号： H01J37/32 ,  C23C16/50 ,  C23C16/52 ,  C23C16/455

摘要： A substrate processing system includes a plasma generator configured to supply (radio frequency) RF power to an electrode arranged in a processing chamber. A sensor is configured to sense a parameter of the RF power supplied to the electrode. A controller is configured to compensate variations in a rate of a plasma process due to variations in bulk resistivity of a substrate arranged on a substrate support by causing the sensor to sense the parameter at least one of prior to plasma processing of the substrate and after a predetermined period after the plasma processing of the substrate begins; and adjusting the parameter of the RF power for the substrate during the plasma processing of the substrate based on the parameter sensed for the substrate.