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    Optoelectronic device packaging assemblies and methods of making the same
    1.
    发明授权
    Optoelectronic device packaging assemblies and methods of making the same 失效
    光电器件封装组件及其制造方法

    公开(公告)号：US07427524B2

    公开(公告)日：2008-09-23

    申请号：US11202596

    申请日：2005-08-11

    申请人： Lawrence R. McColloch ,  James A. Matthews ,  Robert E. Wilson ,  Brenton A. Baugh

    发明人： Lawrence R. McColloch ,  James A. Matthews ,  Robert E. Wilson ,  Brenton A. Baugh

    IPC分类号： H01L33/00

    CPC分类号： H01S5/4031 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4245 ,  G02B6/4251 ,  G02B6/426 ,  G02B6/4266 ,  G02B6/4267 ,  G02B6/4272 ,  G02B6/4274 ,  G02B6/428 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01S5/005 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02284 ,  H01L2924/00

    摘要： Optoelectronic device packaging assemblies and methods of making the same are described. In one aspect, an optoelectronic device packaging assembly includes an electrical sub-mount that includes a mounting area, a device turning mount, and a light-emitting device. The device turning mount has a sub-mount mounting side that is attached to the mounting area of the electrical sub-mount and a device mounting side that has a device mounting area that is oriented in a plane that is substantially perpendicular to the mounting area of the electrical sub-mount. The light-emitting device includes one or more semiconductor layers that terminate at a common light-emitting surface and are operable to emit light from the light-emitting surface. The light-emitting device is attached to the device mounting area of the device turning mount with the light-emitting surface oriented in a plane that is substantially parallel to the mounting area of the electrical sub-mount.

    摘要翻译： 描述了光电器件封装组件及其制造方法。 在一个方面，一种光电子器件封装组件包括一个包括安装区域的电子安装座，一个装置转动架和一个发光装置。 装置转向架具有安装在电子安装座的安装区域上的副安装安装侧和装置安装侧，该装置安装侧具有在与基本上垂直于 电子底座。 发光器件包括一个或多个半导体层，其终止于共同的发光表面并且可操作以从发光表面发射光。 发光装置被附接到装置转向架的装置安装区域，其中发光表面定向在基本上平行于电子安装座的安装区域的平面内。