公开(公告)号：US20110280277A1

公开(公告)日：2011-11-17

申请号：US12735356

申请日：2009-01-17

申请人： Lee Chung ,  Kalar Kent ,  Mahesh Ajgaonkar ,  Michael Sanders

发明人： Lee Chung ,  Kalar Kent ,  Mahesh Ajgaonkar ,  Michael Sanders

IPC分类号： G01N21/47 ,  G01K3/00 ,  G01K11/32

CPC分类号： G01K11/32

摘要： Systems and methods for extending the range of a fiber optic DTS system are provided. In one respect, a method may provide steps for transmitting, in a first time period, an optical signal at a first energy level through an optical fiber, collecting backscatter signals as a result of the first transmission, adjusting the first energy level to a second energy level, transmitting, in an additional time period, the adjusted optical signal through the optical fiber, collecting backscatter signals as a result of the adjusted transmissions, and using a portion of the collected backscatter as a result of the first transmission and a portion of the collected backscatter as a result of the additional transmissions, determining one or more parameter profiles, such as a temperature profile.

摘要翻译： 提供了用于扩展光纤DTS系统范围的系统和方法。 在一个方面，一种方法可以提供在第一时间段内通过光纤在第一能级发射光信号的步骤，作为第一传输的结果收集反向散射信号，将第一能级调整到第二能级 能量水平，在额外的时间段内通过光纤传输经调整的光信号，作为经调整的传输的结果收集后向散射信号，并且作为第一次传输的结果使用收集的反向散射的一部分， 作为附加传输的结果的收集的反向散射，确定一个或多个参数分布，诸如温度分布。

公开(公告)号：US20070020778A1

公开(公告)日：2007-01-25

申请号：US11189180

申请日：2005-07-25

申请人： Cheng Yi ,  Chiou Yean ,  Hung-Hon Lui ,  Lee Chung

发明人： Cheng Yi ,  Chiou Yean ,  Hung-Hon Lui ,  Lee Chung

IPC分类号： H01L21/66

CPC分类号： H01L22/32 ,  H01L22/14 ,  H01L2924/0002 ,  H01L2924/00

摘要： A 3-dimensional PCM structure and method for using the same for carrying out 3-dimensional integrated circuit wiring electrical testing and failure analysis in an integrated circuit manufacturing process, the method including forming a first metallization layer; carrying out a first wafer acceptance testing (WAT) process to test the electrical continuity of the first metallization layer; forming first metal vias on the first metallization layer conductive portions and a second metallization layer comprising metal islands on the first metal vias wherein the metal islands electrically communicate with the first metallization layer to form a process control monitor (PCM) structure; and, carrying out a second WAT process to test the electrical continuity of the first metallization layer.

摘要翻译： 一种用于在集成电路制造工艺中进行三维集成电路布线电气测试和故障分析的三维PCM结构及其方法，所述方法包括形成第一金属化层; 执行第一晶片验收测试（WAT）过程以测试第一金属化层的电连续性; 在所述第一金属化层导电部分上形成第一金属通孔，以及在所述第一金属通孔上形成包含金属岛的第二金属化层，其中所述金属岛与所述第一金属化层电连通以形成过程控制监视器（PCM）结构; 以及进行第二WAT处理以测试第一金属化层的电连续性。

公开(公告)号：US6042736A

公开(公告)日：2000-03-28

申请号：US971893

申请日：1997-11-17

申请人： Lee Chung

发明人： Lee Chung

IPC分类号： G01N1/32 ,  B44C1/22 ,  H01L21/00

CPC分类号： G01N1/32 ,  H01J2237/31745

摘要： The present invention provides a method for preparing samples for microscopic examination that requires a glass slide to be laminated to a sample substrate by an adhesive layer for polishing in a sample polishing process. A cavity can be first formed in the surface of the substrate by a focused ion beam technique to reveal a characteristic feature which needs to be examined. A wax-based material is then used to fill the cavity and to protect the characteristic feature before an adhesive layer is applied on top of the substrate for bonding a glass slide to the substrate. After the sample is sectioned in the polishing process to reveal a new cross-section that contains the characteristic feature, the protective coating of the wax-based material can be removed by a suitable solvent such that the characteristic feature is ready for microscopic examination. A suitable wax-based material can be a wax that is similar to a candle wax which can be easily removed by acetone.

摘要翻译： 本发明提供了一种制备用于显微镜检查的样品的方法，其需要通过用于在样品抛光工艺中抛光的粘合剂层将玻璃载片层压到样品基底上。 可以首先通过聚焦离子束技术在衬底的表面中形成空腔，以揭示需要检查的特征。 然后使用蜡基材料填充空腔并保护特征，然后将粘合剂层施加在基底上方，以将玻璃载片粘合到基底上。 在抛光过程中将样品切片以显示包含特征特征的新横截面之后，可以通过合适的溶剂去除蜡基材料的保护涂层，使得特征可用于显微镜检查。 合适的蜡基材料可以是类似于可以通过丙酮容易地除去的蜡烛蜡的蜡。

公开(公告)号：US6007409A

公开(公告)日：1999-12-28

申请号：US57266

申请日：1998-04-08

申请人： Lee Chung

发明人： Lee Chung

IPC分类号： B24B37/10 ,  B24B37/30 ,  B24B37/04

CPC分类号： B24B37/102 ,  B24B37/30

摘要： The present invention discloses a sample holder for a miniature device for use in a parallel lapping tool that is equipped with a hollow-centered sample holder assembly such that the condition of the sample being prepared can be continuously monitored from either the top side or the bottom side of the holder, and at least three adjusting screws that are used to adjust a plane of lapping to be the same as the plane of interest in said miniature device to be observed such that once the plane is obtained, only the sample displacement knob situated at the center of the holder needs to be adjusted to further advance the sample for removal of more material.

摘要翻译： 本发明公开了一种用于平行研磨工具中的微型装置的样品保持器，其配备有中空中心的样品保持器组件，使得可以从顶侧或底部连续监测制备的样品的状态 并且至少三个调节螺钉，其用于将研磨平面调整为与要观察的所述微型装置中的感兴趣平面相同，使得一旦获得平面，仅位于样品位移旋钮 在支架的中心需要调整以进一步推进样品以便更多的材料去除。