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公开(公告)号:US20240413133A1
公开(公告)日:2024-12-12
申请号:US18733292
申请日:2024-06-04
Applicant: Lextar Electronics Corporation
Inventor: Shiou-Yi KUO , Chin-Hung LUNG , Bo-Yu CHEN
IPC: H01L25/075
Abstract: A wafer with micro integrated circuits includes a transparent substrate and a plurality of micro components. The micro components are each attached to the transparent substrate by a plurality of transparent adhesive layers. Each of the micro components includes a bonding pad in direct contact with the transparent adhesive layer and an etching stop layer located on the side of the micro components opposite from the bonding pad.
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公开(公告)号:US20240128414A1
公开(公告)日:2024-04-18
申请号:US18482331
申请日:2023-10-06
Applicant: Lextar Electronics Corporation
Inventor: Shiou-Yi KUO , Chin-Hung LUNG , Yu-Chun LEE , Hung-Chun TONG
IPC: H01L33/50 , H01L25/075
CPC classification number: H01L33/507 , H01L25/0753 , H01L33/502 , H01L2933/0041
Abstract: A light-emitting device is provided. The light-emitting device includes a light-emitting unit and a light-conversion structure disposed on the light-emitting unit, wherein the light-conversion structure includes a quantum dot layer and an etching blocking layer disposed on one of the surfaces of the quantum dot layer.
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