公开(公告)号：US20240413133A1

公开(公告)日：2024-12-12

申请号：US18733292

申请日：2024-06-04

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Chin-Hung LUNG ,  Bo-Yu CHEN

IPC: H01L25/075

Abstract: A wafer with micro integrated circuits includes a transparent substrate and a plurality of micro components. The micro components are each attached to the transparent substrate by a plurality of transparent adhesive layers. Each of the micro components includes a bonding pad in direct contact with the transparent adhesive layer and an etching stop layer located on the side of the micro components opposite from the bonding pad.

公开(公告)号：US20240128414A1

公开(公告)日：2024-04-18

申请号：US18482331

申请日：2023-10-06

Applicant: Lextar Electronics Corporation

Inventor： Shiou-Yi KUO ,  Chin-Hung LUNG ,  Yu-Chun LEE ,  Hung-Chun TONG

IPC: H01L33/50 ,  H01L25/075

CPC classification number: H01L33/507 ,  H01L25/0753 ,  H01L33/502 ,  H01L2933/0041

Abstract: A light-emitting device is provided. The light-emitting device includes a light-emitting unit and a light-conversion structure disposed on the light-emitting unit, wherein the light-conversion structure includes a quantum dot layer and an etching blocking layer disposed on one of the surfaces of the quantum dot layer.