WAFER WITH MICRO INTEGRATED CIRCUITS

    公开(公告)号:US20240413133A1

    公开(公告)日:2024-12-12

    申请号:US18733292

    申请日:2024-06-04

    Abstract: A wafer with micro integrated circuits includes a transparent substrate and a plurality of micro components. The micro components are each attached to the transparent substrate by a plurality of transparent adhesive layers. Each of the micro components includes a bonding pad in direct contact with the transparent adhesive layer and an etching stop layer located on the side of the micro components opposite from the bonding pad.

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