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    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
    1.
    发明申请
    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL 有权

    公开(公告)号：US20220271251A1

    公开(公告)日：2022-08-25

    申请号：US17663431

    申请日：2022-05-15

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

    LIGHT-EMITTING DEVICE AND BACKLIGHT MODULE THEREOF
    2.
    发明申请
    LIGHT-EMITTING DEVICE AND BACKLIGHT MODULE THEREOF 有权

    公开(公告)号：US20220137280A1

    公开(公告)日：2022-05-05

    申请号：US17448351

    申请日：2021-09-21

    Applicant: Lextar Electronics Corporation

    Inventor： Lung-Kuan LAI ,  Jian-Chin LIANG

    IPC: F21V8/00

    Abstract: The present disclosure proposes a light-emitting device and a backlight module thereof. The light-emitting elements includes a substrate, a plurality of light-emitting elements, a light guide layer, a plurality of first light adjustment patterns, and a plurality of second light adjustment patterns. The light-emitting elements are disposed on the substrate. The light guide layer covers the substrate and the light-emitting elements. The first light adjustment patterns are disposed over or embedded within the light guide layer, and each of the first light adjustment patterns is located above each of the light-emitting elements, respectively. The second light adjustment patterns are disposed on or embedded in the light guide layer, and the second light adjustment patterns surround the corresponding first light adjustment patterns, respectively. The first light adjustment patterns and second light adjustment patterns have a refractive index smaller than that of the light guide layer.

    LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE
    3.
    发明申请
    LIGHT EMITTING DEVICE AND LIGHT EMITTING MODULE 有权

    公开(公告)号：US20210210931A1

    公开(公告)日：2021-07-08

    申请号：US16984176

    申请日：2020-08-04

    Applicant: Lextar Electronics Corporation

    Inventor： Ting-Kai CHEN ,  Lung-Kuan LAI ,  Jian-Chin LIANG

    IPC: H01S5/40 ,  H01S5/022

    Abstract: A light emitting device includes an edge emitting laser chip and a reflecting mirror. The edge emitting laser chip has light emitting ports arranged in parallel in a first direction. The light emitting ports emit light beams in a second direction. The reflecting mirror includes a reflecting surface used to reflect the light beams to a third direction. The first, second and third direction are perpendicular to each other. The light beams are emitted to the reflecting surface through the virtual incident plane and project first light spots on the reflecting surface. Each projected light spot has a first axis length in the first direction and a third axis length in the third direction. An interval between two immediately-adjacent light emitting ports is greater than the first axis length of one of the two projected light spots aligned with the two immediately-adjacent light emitting ports.

    LIGHT EMITTING MODULE AND OPTICAL LENS THEREOF
    5.
    发明申请
    LIGHT EMITTING MODULE AND OPTICAL LENS THEREOF 有权

    公开(公告)号：US20220382106A1

    公开(公告)日：2022-12-01

    申请号：US17329140

    申请日：2021-05-25

    Applicant: Lextar Electronics Corporation

    Inventor： Lung-Kuan LAI ,  Ting-Kai CHEN ,  Jiun-Hong LIN

    IPC: G02F1/1335 ,  G02F1/13357

    Abstract: An optical lens includes an optical transparent body which has an upper surface, a lower surface, a lateral surface and a lower concave portion. The upper surface includes a central upper concave portion, an outwardly-concave curved surface continuous from the central upper concave portion, and an inwardly-concave curved surface continuous from the outwardly-concave curved surface. The lateral surface is connected between the inwardly-concave curved surface and the lower surface. The lower concave portion is recessed from the lower surface.

    LED PACKAGE STRUCTURE
    6.
    发明申请
    LED PACKAGE STRUCTURE 有权

    公开(公告)号：US20210288233A1

    公开(公告)日：2021-09-16

    申请号：US17195539

    申请日：2021-03-08

    Applicant: Lextar Electronics Corporation

    Inventor： Chang-Han CHEN ,  Chun-Peng LIN ,  Lung-Kuan LAI

    IPC: H01L33/60 ,  H01L33/48 ,  H01L33/58 ,  H01L33/62

    Abstract: A light emitting diode (LED) package structure includes a circuit board, a reflective cup, a LED chip and a lens structure. The reflective cup is mounted on the circuit board, wherein the reflective cup and the circuit board collectively form a concave cup with an opening. The reflective cup has a first metal ring in the concave cup. The LED chip is mounted on the circuit board and within the concave cup. The lens structure has a second metal ring configured to join the first metal ring to cover the opening.

    LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    8.
    发明申请
    LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20220246813A1

    公开(公告)日：2022-08-04

    申请号：US17572649

    申请日：2022-01-11

    Applicant: Lextar Electronics Corporation

    Inventor： Lung-Kuan LAI ,  Jian-Chin LIANG

    IPC: H01L33/62 ,  H01L25/075

    Abstract: A light-emitting device includes a substrate, a circuit layer, a plurality of conductive connection portions, and a plurality of semiconductor light-emitting sources. The circuit layer on the substrate having a plurality of conductive structures, in which each conductive structure includes at least one bonding pad. An interval is between two adjacent ones of the conductive structures. Each conductive connection portion is correspondingly located on each bonding pad. Each semiconductor light-emitting source crosses each interval and contacts two adjacent ones of the conductive connection portions, such that the semiconductor light-emitting sources are respectively electrically connected to two adjacent ones of the conductive structures.

    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
    9.
    发明申请
    PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL 审中-公开

    公开(公告)号：US20200067009A1

    公开(公告)日：2020-02-27

    申请号：US16232041

    申请日：2018-12-25

    Applicant: Lextar Electronics Corporation

    Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

    IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

    Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

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