公开(公告)号：US20220271251A1

公开(公告)日：2022-08-25

申请号：US17663431

申请日：2022-05-15

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20210210931A1

公开(公告)日：2021-07-08

申请号：US16984176

申请日：2020-08-04

Applicant: Lextar Electronics Corporation

Inventor： Ting-Kai CHEN ,  Lung-Kuan LAI ,  Jian-Chin LIANG

IPC: H01S5/40 ,  H01S5/022

Abstract: A light emitting device includes an edge emitting laser chip and a reflecting mirror. The edge emitting laser chip has light emitting ports arranged in parallel in a first direction. The light emitting ports emit light beams in a second direction. The reflecting mirror includes a reflecting surface used to reflect the light beams to a third direction. The first, second and third direction are perpendicular to each other. The light beams are emitted to the reflecting surface through the virtual incident plane and project first light spots on the reflecting surface. Each projected light spot has a first axis length in the first direction and a third axis length in the third direction. An interval between two immediately-adjacent light emitting ports is greater than the first axis length of one of the two projected light spots aligned with the two immediately-adjacent light emitting ports.

公开(公告)号：US20200067009A1

公开(公告)日：2020-02-27

申请号：US16232041

申请日：2018-12-25

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H01L51/50 ,  H01L51/52 ,  H01L33/60

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20230413594A1

公开(公告)日：2023-12-21

申请号：US18460673

申请日：2023-09-04

Applicant: Lextar Electronics Corporation

Inventor： Hui-Ru WU ,  Jian-Chin LIANG ,  Jo-Hsiang CHEN ,  Lung-Kuan LAI ,  Cheng-Yu TSAI ,  Hsin-Lun SU ,  Ting-Kai CHEN

IPC: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/86 ,  H10K50/80

CPC classification number: H10K50/125 ,  H01L33/60 ,  H10K50/856 ,  H10K50/865 ,  H10K50/868

Abstract: A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.

公开(公告)号：US20220382106A1

公开(公告)日：2022-12-01

申请号：US17329140

申请日：2021-05-25

Applicant: Lextar Electronics Corporation

Inventor： Lung-Kuan LAI ,  Ting-Kai CHEN ,  Jiun-Hong LIN

IPC: G02F1/1335 ,  G02F1/13357

Abstract: An optical lens includes an optical transparent body which has an upper surface, a lower surface, a lateral surface and a lower concave portion. The upper surface includes a central upper concave portion, an outwardly-concave curved surface continuous from the central upper concave portion, and an inwardly-concave curved surface continuous from the outwardly-concave curved surface. The lateral surface is connected between the inwardly-concave curved surface and the lower surface. The lower concave portion is recessed from the lower surface.