USE OF DIFFERENT PAIRS OF OVERLAY LAYERS TO CHECK AN OVERLAY MEASUREMENT RECIPE
    1.
    发明申请
    USE OF DIFFERENT PAIRS OF OVERLAY LAYERS TO CHECK AN OVERLAY MEASUREMENT RECIPE 审中-公开
    使用不同层次的覆盖层检查覆盖层测量

    公开(公告)号:US20100063764A1

    公开(公告)日:2010-03-11

    申请号:US12208140

    申请日:2008-09-10

    IPC分类号: G01P21/00

    摘要: An overlay measurement recipe is checked for reliability as follows. A first pair of overlay layers (130, 150) is formed (610), and the recipe is used to obtain alignment measurements for the two layers. Then another pair of overlay layers (130, 150) is obtained (630), possibly using the same masks, but this time at least one of the layers (150) is offset from its previous position. The overlay measurement recipe is used again to obtain alignment measurements (640). The two sets of measurements are checked against the offset of the layers from their previous positions to validate the recipe. Other embodiments are also provided.

    摘要翻译: 检查覆盖测量配方的可靠性如下。 形成第一对覆盖层(130,150)(610),并且使用该配方来获得两层的对准测量结果。 然后获得另一对覆盖层(130,150)(630),可能使用相同的掩模,但是此时,层(150)中的至少一个从其先前位置偏移。 再次使用覆盖测量配方以获得对准测量(640)。 对两组测量结果进行检查,以使层与其先前位置的偏移量进行检验,以验证配方。 还提供了其他实施例。

    PHOTOLITHOGRAPHIC PATTERNING OF ARRAYS OF PILLARS HAVING WIDTHS AND LENGTHS BELOW THE EXPOSURE WAVELENGTHS
    2.
    发明申请
    PHOTOLITHOGRAPHIC PATTERNING OF ARRAYS OF PILLARS HAVING WIDTHS AND LENGTHS BELOW THE EXPOSURE WAVELENGTHS 审中-公开
    具有宽度和长度的支柱阵列的平面图的曝光波长

    公开(公告)号:US20100068658A1

    公开(公告)日:2010-03-18

    申请号:US12233298

    申请日:2008-09-18

    IPC分类号: G03F7/20

    CPC分类号: G03F1/00 G03F7/70558

    摘要: A pillar array is printed in positive photoresist using an optical mask (108) having an array of features (310) corresponding to the pillars. The pillars' width/length dimensions are below the exposure wavelength. Superior results can be achieved (less peeling off of the pillars and less overexposure at the center of each pillar) if the mask features (310) are downsized relative to the pillars' target sizes, and the exposure energy is reduced. Negative photoresist (with a dark field mask) can be used, and can provide good results (in terms of pillars peeling-off) if the combined area of the features (410) corresponding to the pillars is smaller than the area between the features (410).

    摘要翻译: 使用具有对应于柱的特征阵列(310)的光学掩模(108)将柱阵列印刷在正性光致抗蚀剂中。 支柱的宽度/长度尺寸低于曝光波长。 如果掩模特征(310)相对于柱体的目标尺寸减小,并且曝光能量减小,则可以实现优异的结果(较少的柱的剥离和在每个柱的中心处较少的过度曝光)。 如果与柱相对应的特征(410)的组合面积小于特征之间的面积,则可以使用负光致抗蚀剂(具有暗场掩模),并且可以提供良好的结果(在柱子剥离方面) 410)。

    PHOTOLITHOGRAPHY WITH OPTICAL MASKS HAVING MORE TRANSPARENT FEATURES SURROUNDED BY LESS TRANSPARENT FEATURES
    3.
    发明申请
    PHOTOLITHOGRAPHY WITH OPTICAL MASKS HAVING MORE TRANSPARENT FEATURES SURROUNDED BY LESS TRANSPARENT FEATURES 有权
    具有透明特征的透明特征的光学照相机

    公开(公告)号:US20090297956A1

    公开(公告)日:2009-12-03

    申请号:US12128456

    申请日:2008-05-28

    IPC分类号: G03F1/00 G03F7/20

    CPC分类号: G03F7/70441 G03F1/36 G03F1/50

    摘要: In photolithographic exposure, a feature (144) of an optical mask is projected onto a dark area (160). The light intensity inside the dark area is reduced by providing a non-printable clear cutout (410) inside the feature. The optical mask has the same optical pathlength outside the feature (144) adjacent to the entire outer boundary of the feature as at the cutout, the optical pathlength being measured along the optical mask's thickness.

    摘要翻译: 在光刻曝光中,将光学掩模的特征(144)投影到暗区(160)上。 通过在特征内部提供不可打印的清晰切口(410)来减少暗区内的光强度。 光掩模在与切口处相同的特征的整个外边界附近的特征(144)之外具有相同的光程,沿着光学掩模的厚度测量光程。

    Photolithography with optical masks having more transparent features surrounded by less transparent features
    4.
    发明授权
    Photolithography with optical masks having more transparent features surrounded by less transparent features 有权
    具有光学掩模的光刻具有更透明的特征,由较不透明的特征包围

    公开(公告)号:US07771903B2

    公开(公告)日:2010-08-10

    申请号:US12128456

    申请日:2008-05-28

    IPC分类号: G03F1/00 G03C5/00

    CPC分类号: G03F7/70441 G03F1/36 G03F1/50

    摘要: In photolithographic exposure, a feature (144) of an optical mask is projected onto a dark area (160). The light intensity inside the dark area is reduced by providing a non-printable clear cutout (410) inside the feature. The optical mask has the same optical pathlength outside the feature (144) adjacent to the entire outer boundary of the feature as at the cutout, the optical pathlength being measured along the optical mask's thickness.

    摘要翻译: 在光刻曝光中,将光学掩模的特征(144)投影到暗区(160)上。 通过在特征内部提供不可打印的清晰切口(410)来减少暗区内的光强度。 光掩模在与切口处相同的特征的整个外边界附近的特征(144)之外具有相同的光程,沿着光学掩模的厚度测量光程。

    FORMING REVERSE ILLUMINATION PATTERNS
    5.
    发明申请
    FORMING REVERSE ILLUMINATION PATTERNS 审中-公开
    形成逆向照明模式

    公开(公告)号:US20090253079A1

    公开(公告)日:2009-10-08

    申请号:US12098845

    申请日:2008-04-07

    IPC分类号: G03F7/00

    CPC分类号: G03F7/70325 G03F7/70091

    摘要: In photolithographic exposure, the illumination pattern (120R) formed on a photosensitive surface (106) is a reverse of the pattern (130) on the optical mask (124). The reverse pattern (120R) is obtained using off-axis illumination when the photosensitive surface is at other than the best focus position.

    摘要翻译: 在光刻曝光中,形成在光敏表面(106)上的照明图案(120R)与光学掩模(124)上的图案(130)相反。 当感光表面处于除最佳聚焦位置之外时,使用离轴照明获得反向图案(120R)。