公开(公告)号：US06983110B2

公开(公告)日：2006-01-03

申请号：US09792150

申请日：2001-02-22

申请人： Lisa A. Buckman ,  Ian Hardcastle

发明人： Lisa A. Buckman ,  Ian Hardcastle

IPC分类号： H04B10/06

CPC分类号： H04B10/69

摘要： The optical receiver comprises an optical input path, a light detector array, an optical converging element and an information signal generator. The light detector array includes light detectors and a light-sensitive surface. Each light detector generates an electrical signal in response to light. The optical converging element is located to focus an optical input signal received via the optical input path to form a spot on the light-sensitive surface of the light detector array. The spot has an area less than the area of the light-sensitive surface but greater than the area of one of the light detectors. The information signal generator generates an electrical information signal from at least one of the electrical signals. In an embodiment, the information signal generator includes a summer that sums the electrical signals generated by the light detectors to generate the electrical information signal. In another embodiment, the information signal generator operates to identify the electrical signals generated in response to the optical input signal, to generate the electrical information signal from the electrical signals and to exclude from the electrical information signal ones of the electrical signals not identified as being generated in response to the optical input signal. In another embodiment, the information signal generator selects one of the identified electrical signals as the electrical information signal.

公开(公告)号：US07978981B2

公开(公告)日：2011-07-12

申请号：US10080944

申请日：2002-02-22

申请人： Lisa A. Buckman ,  Frank H. Peters ,  Brian E. Lemoff

发明人： Lisa A. Buckman ,  Frank H. Peters ,  Brian E. Lemoff

IPC分类号： H04B10/00

CPC分类号： H04B10/801

摘要： A low cost, high speed, short haul, optic interconnect and data link which employs an array of vertical cavity surface emitting laser (VCSEL) arrays through which several optical signals are simultaneously transmitted through collimating optics that generate multiple, multiple-wavelength optical signals. Each combined optical signal is transmitted to a receiver array comprising a plurality of optical filters and photodetector arrangements that have a number of sections, each having an optical filter to pass a specific optical wavelength, and a mating photodetector element to convert the specific optical signal to an electrical signal. The signals may be coupled between the transmitter array and the receiver array through free space or through optical fibers.

摘要翻译： 低成本，高速度，短距离，光学互连和数据链路，其采用垂直腔表面发射激光器（VCSEL）阵列阵列，多个光信号通过该阵列同时通过产生多个多波长光信号的准直光学器件传输。 每个组合的光信号被传输到包括多个滤光器和光电检测器布置的接收器阵列，所述多个滤光器和光电检测器布置具有多个部分，每个部分具有通过特定光波长的滤光器，以及配合光电检测器元件以将特定光信号转换为 电信号。 信号可以通过自由空间或通过光纤耦合在发射器阵列和接收器阵列之间。

公开(公告)号：US07653272B2

公开(公告)日：2010-01-26

申请号：US10252145

申请日：2002-09-19

申请人： Kit M. Cham ,  Lisa A. Buckman

发明人： Kit M. Cham ,  Lisa A. Buckman

IPC分类号： G02B6/12

CPC分类号： G02B6/3512 ,  G02B6/3546 ,  G02B6/3596 ,  G02B6/43

摘要： An optical communications system including a method and apparatus with an electro-optical chip which includes optical interface elements in optical interface array configuration on a first side of the electro-optical chip, attached to or integrated with an optical circuit board which includes a plurality of layered optical wave guides, a plurality of coupling elements disposed relative to the electro-optical chip such that the plurality of coupling elements optically communicate with the first plurality of optical interface elements on the electro-optical chip, and wherein the coupling elements are further disposed to optically communicate with the plurality of optical wave guides.

摘要翻译： 一种光通信系统，包括具有电光芯片的方法和装置，所述方法和装置包括在所述电光芯片的第一侧上的光接口阵​​列配置中的光接口元件，所述光接口元件附接到或与光电路板集成，所述光电路板包括多个 分层光波导，相对于电光芯片设置的多个耦合元件，使得多个耦合元件与电光芯片上的第一多个光接口元件光学连通，并且其中耦合元件进一步设置 与多个光波导光学通信。

公开(公告)号：US06882044B2

公开(公告)日：2005-04-19

申请号：US10150303

申请日：2002-05-17

申请人： Brian E. Lemoff ,  Lisa A. Buckman

发明人： Brian E. Lemoff ,  Lisa A. Buckman

IPC分类号： H05K3/20 ,  H01L21/60 ,  H01L21/68 ,  H01L25/075 ,  H01L25/16 ,  H01L31/02 ,  H01L33/00 ,  H05K1/14 ,  H05K3/36 ,  H01L23/34

CPC分类号： H01L21/6835 ,  H01L25/0753 ,  H01L25/167 ,  H01L2221/68359 ,  H01L2924/00014 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/148 ,  H05K3/20 ,  H01L2224/48 ,  H01L2924/00

摘要： Conductors to interconnect electronic devices, the conductors being formed on a detachable substrate. The substrate is aligned with a package containing electronic devices. The conductors are bonded to pads on the devices. Then, the substrate is detached. Each conductor is self supporting between the devices, has a two dimensional shape and has a surface that is substantially parallel to a surface of the pads.

摘要翻译： 用于互连电子设备的导体，导体形成在可拆卸的基板上。 衬底与包含电子器件的封装对准。 导体被接合到器件上的焊盘。 然后，剥离基板。 每个导体在装置之间是自支撑的，具有二维形状并且具有基本平行于衬垫表面的表面。