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公开(公告)号:US5703408A
公开(公告)日:1997-12-30
申请号:US419558
申请日:1995-04-10
申请人: Liu Ming-Tsung , Bill Y. B. Hsu , Hsien-Dar Chung , Der-Yuan Wu
发明人: Liu Ming-Tsung , Bill Y. B. Hsu , Hsien-Dar Chung , Der-Yuan Wu
IPC分类号: H01L23/485 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号: H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05073 , H01L2224/05166 , H01L2224/05184 , H01L2224/05187 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05647 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2924/15787 , Y10T29/49124 , Y10T29/49155 , Y10T29/49204
摘要: A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.
摘要翻译: 一种用于形成改进的接合焊盘的结构和工艺,其允许接合线和金属接合焊盘之间的更好的接合。 条纹形成在基板上。 在条纹上形成保形电介质层,保形阻挡层和金属层。 形成具有窗口的钝化层,限定了焊盘区域。 条纹促进阻挡层和金属层中的不规则表面,其减小介电层,阻挡层和金属层之间的应力。 此外,不规则表面增加了对电介质层的阻挡金属粘附性,减少了接合焊盘剥离,并增加了粘合产率。
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公开(公告)号:US5834365A
公开(公告)日:1998-11-10
申请号:US917407
申请日:1997-08-25
申请人: Liu Ming-Tsung , Bill Y. B. Hsu , Hsien-Dar Chung , Dev-Yuan Wu
发明人: Liu Ming-Tsung , Bill Y. B. Hsu , Hsien-Dar Chung , Dev-Yuan Wu
IPC分类号: H01L23/485 , H01L21/44
CPC分类号: H01L24/05 , H01L24/03 , H01L2224/02166 , H01L2224/05073 , H01L2224/05166 , H01L2224/05184 , H01L2224/05187 , H01L2224/05556 , H01L2224/05558 , H01L2224/05624 , H01L2224/05647 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01082 , H01L2924/04941 , H01L2924/05042 , H01L2924/14 , H01L2924/15787 , Y10T29/49124 , Y10T29/49155 , Y10T29/49204
摘要: A structure and a process for forming an improved bonding pad which allows better bonding between a bond wire and a metal bonding pad. Stripes are formed on a substrate. A conformal dielectric layer, a conformal barrier layer and a metal layer are formed over the stripes. A passivation layer with a window is formed defining a bonding pad area. The stripes promote an irregular surface in the barrier and metal layers which reduce stress between the dielectric layer, the barrier layer and the metal layer. Also, the irregular surfaces increase the barrier metal adhesion to the dielectric layer, reduce bond pad peel off, and increase bonding yields.
摘要翻译: 一种用于形成改进的接合焊盘的结构和工艺,其允许接合线和金属接合焊盘之间的更好的接合。 条纹形成在基板上。 在条纹上形成保形电介质层,保形阻挡层和金属层。 形成具有窗口的钝化层,限定了焊盘区域。 条纹促进阻挡层和金属层中的不规则表面,其减小介电层,阻挡层和金属层之间的应力。 此外,不规则表面增加了对电介质层的阻挡金属粘附性,减少了接合焊盘剥离,并增加了粘合产率。
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