摘要:
A computer implemented method, data processing system, and computer usable code are provided for burn-in testing of a multiprocessor. A process identifies a power management data set for a plurality of processor cores associated with the multiprocessor. The process selects one or more of the plurality of processor cores to form a selected set of processor cores based upon the power management data set. The process initiates a burn-in test across the selected set of processor cores. In response to a determination that all processor cores in the plurality of processor cores have not been selected, the process repeats the above selecting and initiating steps until all the processor cores have been selected.
摘要:
A system and method to optimize multi-core microprocessor performance using voltage offsets is presented. A multi-core device tests each of its processor cores in order to identify each processor core's optimum supply voltage. In turn, the device configures voltage offset networks for each processor core based upon each processor core's identified optimum supply voltage. As a result, the offset voltages produced by the voltage offset networks are subtracted from the multi-core device's main voltage, which results in the voltage offset networks supplying optimum supply voltages to each processor core. The voltage offset networks may include fuses to generate a fixed voltage offset, or the voltage offset networks may include a control circuit to dynamically adjust voltage offsets during the multi-core device's operation.
摘要:
A computer implemented method, data processing system, and computer usable code are provided for burn-in testing of a multiprocessor. A process identifies a power management data set for a plurality of processor cores associated with the multiprocessor. The process selects one or more of the plurality of processor cores to form a selected set of processor cores based upon the power management data set. The process initiates a burn-in test across the selected set of processor cores. In response to a determination that all processor cores in the plurality of processor cores have not been selected, the process repeats the above selecting and initiating steps until all the processor cores have been selected.
摘要:
A system and method to optimize multi-core microprocessor performance using voltage offsets is presented. A multi-core device tests each of its processor cores in order to identify each processor core's optimum supply voltage. In turn, the device configures voltage offset networks for each processor core based upon each processor core's identified optimum supply voltage. As a result, the offset voltages produced by the voltage offset networks are subtracted from the multi-core device's main voltage, which results in the voltage offset networks supplying optimum supply voltages to each processor core. The voltage offset networks may include fuses to generate a fixed voltage offset, or the voltage offset networks may include a control circuit to dynamically adjust voltage offsets during the multi-core device's operation.
摘要:
A computer implemented method, data processing system, and computer usable code are provided for burn-in testing of a multiprocessor. A process identifies a power management data set for a plurality of processor cores associated with the multiprocessor. The process selects one or more of the plurality of processor cores to form a selected set of processor cores based upon the power management data set. The process initiates a burn-in test across the selected set of processor cores. In response to a determination that all processor cores in the plurality of processor cores have not been selected, the process repeats the above selecting and initiating steps until all the processor cores have been selected.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
An apparatus and method for providing a multi-core integrated circuit chip that reduces the cost of the package and board while optimizing performance of the cores for use with a single voltage plane. The apparatus and method of the illustrative embodiments make use of a dynamic burn-in technique that optimizes all of the cores on the chip to run at peak performance at a single voltage. Each core is burned-in with a customized burn-in voltage that provides uniform power and performance across the whole chip. This results in a higher burn-in yield and lower overall power in the integrated circuit chip. The optimization of the cores to run at peak performance at a single voltage is achieved through use of the negative bias temperature instability affects on the cores imparted by the burn-in voltages applied.