摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
A reduced number of voltage regulator modules provides a reduced number of supply voltages to the package. The package includes a voltage plane for each of the voltage regulator modules. Each core or other component on the die is tied to a switch on the package, and each switch is electrically connected to all of the voltage planes. A wafer-level test determines a voltage that optimizes performance of each core or other component. Given these voltage values, an engineer may determine voltage settings for the voltage regulator modules and which cores are to be connected to which voltage regulator modules. A database stores voltage setting data, such as the optimal voltage for each component, switch values, or voltage settings for each voltage regulator module. An engineering wire may permanently set each switch to customize the voltage supply to each core or other component.
摘要:
An apparatus and method for providing a multi-core integrated circuit chip that reduces the cost of the package and board while optimizing performance of the cores for use with a single voltage plane. The apparatus and method of the illustrative embodiments make use of a dynamic burn-in technique that optimizes all of the cores on the chip to run at peak performance at a single voltage. Each core is burned-in with a customized burn-in voltage that provides uniform power and performance across the whole chip. This results in a higher burn-in yield and lower overall power in the integrated circuit chip. The optimization of the cores to run at peak performance at a single voltage is achieved through use of the negative bias temperature instability affects on the cores imparted by the burn-in voltages applied.
摘要:
A method, apparatus, and computer program product for using a multi-core integrated circuit having cores with differing performance characteristics. The cores are arranged into high and low performance groups and tasks are assigned according to their priority to either a high or low performance group.
摘要:
A multiprocessor system having plural heterogeneous processing units schedules instruction sets for execution on a selected of the processing units by matching workload processing characteristics of processing units and the instruction sets. To establish an instruction set's processing characteristics, the homogeneous instruction set is executed on each of the plural processing units with one or more performance metrics tracked at each of the processing units to determine which processing unit most efficiently executes the instruction set. Instruction set workload processing characteristics are stored for reference in scheduling subsequent execution of the instruction set.
摘要:
A multiprocessor system having plural heterogeneous processing units schedules instruction sets for execution on a selected of the processing units by matching workload processing characteristics of processing units and the instruction sets. To establish an instruction set's processing characteristics, the homogeneous instruction set is executed on each of the plural processing units with one or more performance metrics tracked at each of the processing units to determine which processing unit most efficiently executes the instruction set. Instruction set workload processing characteristics are stored for reference in scheduling subsequent execution of the instruction set.
摘要:
A method, apparatus, and computer program product for using a multi-core integrated circuit to extend the reliability or operating life of an electronic device.