专利检索 ap:("LumiShield Technologies Incorporated") AND inv:"John D. Watkins" 第 1 页

1.

发明授权
Methods and compositions for electrochemical deposition of metal rich layers in aqueous solutions 有权

公开(公告)号：US11111591B2

公开(公告)日：2021-09-07

申请号：US15995220

申请日：2018-06-01

申请人： LumiShield Technologies Incorporated

发明人： Hunaid B. Nulwala , John D. Watkins

IPC分类号： C25D3/02 , C25D3/54 , C25D3/56 , C25D3/44 , C25D9/08 , C25D9/12 , C25D9/10 , C25D5/10

摘要： Methods and compositions for electrodepositing mixed metal reactive metal layers by combining reactive metal complexes with electron withdrawing agents are provided. Modifying the ratio of one reactive metal complex to the other and varying the current density can be used to vary the morphology the metal layer on the substrate.