公开(公告)号：US20190293883A1

公开(公告)日：2019-09-26

申请号：US16424136

申请日：2019-05-28

Applicant: Luxtera, Inc.

Inventor： Daniel Kucharski ,  John Andrew Guckenberger ,  Thierry Pinguet ,  Sherif Abdalla

IPC: G02B6/42

Abstract: A method and system for implementing high-speed electrical interfaces between semiconductor dies in optical communication systems are disclosed and may include communicating electrical signals between a first die and a second die via coupling pads which may be located in low impedance points in Tx and Rx paths. The electrical signals may be communicated via one or more current-mode, controlled impedance, and/or capacitively-coupled interfaces. The current-mode interface may include a cascode amplifier stage split between source and drain terminals of transistors on the dies. The controlled-impedance interfaces may include transmission line drivers on a first die and transmission lines on a second die. The capacitively-coupled interfaces may include capacitors formed by contact pads on the dies. The coupling pads may be connected via one or more of: wire bonds, metal pillars, solder balls, or conductive resin. The dies may comprise CMOS and may be coupled in a flip-chip configuration.

公开(公告)号：US20190238228A1

公开(公告)日：2019-08-01

申请号：US16378119

申请日：2019-04-08

Applicant: Luxtera, Inc.

Inventor： Attila Mekis ,  Peter DeDobbelaere ,  Kosei Yokoyama ,  Sherif Abdalla ,  Steffen Gloeckner ,  John Guckenberger ,  Thierry Pinguet ,  Gianlorenzo Masini ,  Daniel Kucharski

IPC: H04B10/2575 ,  H01L27/12 ,  H04B10/40 ,  H01L21/84

CPC classification number: H04B10/2575 ,  H01L21/84 ,  H01L25/0652 ,  H01L25/167 ,  H01L27/0688 ,  H01L27/1203 ,  H01L2225/06541 ,  H04B10/40

Abstract: Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on two CMOS wafers with different silicon layer thicknesses. The devices may be fabricated on semiconductor-on-insulator (SOI) wafers utilizing a bulk CMOS process and/or on a SOI wafer utilizing a SOI CMOS process. The different thicknesses may be fabricated utilizing a double SOI process and/or a selective area growth process. Cladding layers may be fabricated utilizing one or more oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafer. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. Silicon dioxide or silicon germanium integrated in the CMOS wafer may be utilized as an etch stop layer.

公开(公告)号：US10367664B2

公开(公告)日：2019-07-30

申请号：US15596034

申请日：2017-05-16

Applicant: Luxtera, Inc.

Inventor： Brian Welch ,  Daniel Kucharski

IPC: G02B6/42 ,  H04B10/50 ,  H04B10/60 ,  H04B10/69 ,  H04L25/02 ,  H04L25/06 ,  H04B10/516 ,  H04B10/564

Abstract: Methods and systems for split voltage domain transmitter circuits are disclosed and may include a two-branch output stage including a plurality of CMOS transistors, each branch of the two-branch output stage comprising two stacked CMOS inverter pairs from among the plurality of CMOS transistors; the two stacked CMOS inverter pairs of a given branch being configured to drive a respective load, in phase opposition to the other branch; and a pre-driver circuit configured to receive a differential modulating signal and output, to respective inputs of the two stacked CMOS inverters, two synchronous differential voltage drive signals having a swing of half the supply voltage and being DC-shifted by half of the supply voltage with respect to each other. The load may include a series of diodes that are driven in differential mode via the drive signals. An optical signal may be modulated via the diodes.

公开(公告)号：US09172474B2

公开(公告)日：2015-10-27

申请号：US14229243

申请日：2014-03-28

Applicant: Luxtera, Inc.

Inventor： Brian Welch ,  Daniel Kucharski

IPC: H04B10/564 ,  H04L25/02 ,  H04B10/50 ,  H04B10/516 ,  G02B6/42

CPC classification number: H04L25/061 ,  G02B6/4201 ,  G02B6/4242 ,  H04B10/501 ,  H04B10/516 ,  H04B10/564 ,  H04B10/60 ,  H04B10/693 ,  H04L25/0272

Abstract: Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed and may comprise in an integrated circuit comprising a driver: amplifying a received signal in a plurality of partial voltage domains, and generating the partial voltage domains in a domain splitter in the driver. A voltage domain boundary value between two partial voltage domains may be controlled utilizing a differential amplifier that samples an output voltage of a cascade amplifier that is an input to the driver and controls a current supplying said cascade amplifier. A series of diodes may be driven in differential mode via the amplified signals. An optical signal may be modulated via the diodes, which may be integrated in a Mach-Zehnder modulator or a ring modulator. The diodes may be connected in a distributed configuration. The amplified signals may be communicated to the diodes via transmission lines, which may be even-mode coupled.

Abstract translation: 公开了用于光子学互补金属氧化物半导体（CMOS）芯片的方法和系统，并且可以包括在包括驱动器的集成电路中：放大多个部分电压域中的接收信号，以及在域中产生部分电压域 分配器在驱动程序。 可以利用差分放大器来控制两个部分电压域之间的电压域边界值，所述差分放大器对作为驱动器的输入的级联放大器的输出电压进行采样，并控制提供所述级联放大器的电流。 一系列二极管可以通过放大信号以差分模式驱动。 光信号可以经由二极管进行调制，二极管可集成在马赫 - 曾德尔调制器或环形调制器中。 二极管可以以分布式配置连接。 放大的信号可以经由传输线传送到二极管，传输线可以是偶模耦合的。

公开(公告)号：US10666472B2

公开(公告)日：2020-05-26

申请号：US16526348

申请日：2019-07-30

Applicant: Luxtera, Inc.

Inventor： Brian Welch ,  Daniel Kucharski

IPC: H04L25/06 ,  H04B10/60 ,  H04L25/02 ,  H04B10/50 ,  H04B10/516 ,  H04B10/564 ,  H04B10/69 ,  G02B6/42

Abstract: Methods and systems for split voltage domain transmitter circuits may include a two-branch output stage including a plurality of CMOS transistors, with each branch of the two-branch output stage comprising two stacked CMOS inverter pairs. The two stacked CMOS inverter pairs of a given branch are configured to drive a respective load, in phase opposition to the other branch. A pre-driver circuit is configured to receive a differential modulating signal and output, to respective inputs of the two stacked CMOS inverters, two synchronous differential voltage drive signals having a swing of half the supply voltage and being DC-shifted by half of the supply voltage with respect to each other. The load may include a series of diodes that are driven in differential mode via the drive signals. An optical signal may be modulated via the diodes.

公开(公告)号：US20190296830A1

公开(公告)日：2019-09-26

申请号：US16424137

申请日：2019-05-28

Applicant: Luxtera, Inc.

Inventor： Daniel Kucharski ,  Brian Welch ,  Sherif Abdalla

IPC: H04B10/516 ,  G02F1/01 ,  G02F1/225 ,  G02B26/06 ,  H04B10/54 ,  H04B10/50 ,  H04B10/079

Abstract: Methods and systems for encoding multi-level pulse amplitude modulated signals using integrated optoelectronics are disclosed and may include generating a multi-level, amplitude-modulated optical signal utilizing an optical modulator driven by first and second electrical input signals, where the optical modulator may configure levels in the multi-level amplitude modulated optical signal, drivers are coupled to the optical modulator; and the first and second electrical input signals may be synchronized before being communicated to the drivers. The optical modulator may include optical modulator elements coupled in series and configured into groups. The number of optical modular elements and groups may configure the number of levels in the multi-level amplitude modulated optical signal. Unit drivers may be coupled to each of the groups. The electrical input signals may be synchronized before communicating them to the unit drivers utilizing flip-flops. Phase addition may be synchronized utilizing one or more electrical delay lines.

公开(公告)号：US10305597B2

公开(公告)日：2019-05-28

申请号：US15407440

申请日：2017-01-17

Applicant: Luxtera, Inc.

Inventor： Daniel Kucharski ,  Brian Welch ,  Sherif Abdalla

IPC: G02B26/00 ,  G02F1/01 ,  H04B10/516 ,  G02F1/225 ,  H04B10/50 ,  H04B10/54 ,  G02B26/06 ,  H04B10/079 ,  G02F1/21 ,  G02B26/08

Abstract: Methods and systems for encoding multi-level pulse amplitude modulated signals using integrated optoelectronics are disclosed and may include generating a multi-level, amplitude-modulated optical signal utilizing an optical modulator driven by first and second electrical input signals, where the optical modulator may configure levels in the multi-level amplitude modulated optical signal, drivers are coupled to the optical modulator; and the first and second electrical input signals may be synchronized before being communicated to the drivers. The optical modulator may include optical modulator elements coupled in series and configured into groups. The number of optical modular elements and groups may configure the number of levels in the multi-level amplitude modulated optical signal. Unit drivers may be coupled to each of the groups. The electrical input signals may be synchronized before communicating them to the unit drivers utilizing flip-flops. Phase addition may be synchronized utilizing one or more electrical delay lines.

公开(公告)号：US10061094B2

公开(公告)日：2018-08-28

申请号：US15716103

申请日：2017-09-26

Applicant: Luxtera, Inc.

Inventor： Daniel Kucharski ,  John Andrew Guckenberger ,  Thierry Pinguet ,  Sherif Abdalla

IPC: G02B6/42

Abstract: A method and system for implementing high-speed electrical interfaces between semiconductor dies in optical communication systems are disclosed and may include communicating electrical signals between a first die and a second die via coupling pads which may be located in low impedance points in Tx and Rx paths. The electrical signals may be communicated via one or more current-mode, controlled impedance, and/or capacitively-coupled interfaces. The current-mode interface may include a cascode amplifier stage split between source and drain terminals of transistors on the dies. The controlled-impedance interfaces may include transmission line drivers on a first die and transmission lines on a second die. The capacitively-coupled interfaces may include capacitors formed by contact pads on the dies. The coupling pads may be connected via one or more of: wire bonds, metal pillars, solder balls, or conductive resin. The dies may comprise CMOS and may be coupled in a flip-chip configuration.

公开(公告)号：US20180017747A1

公开(公告)日：2018-01-18

申请号：US15716103

申请日：2017-09-26

Applicant: Luxtera, Inc.

Inventor： Daniel Kucharski ,  John Andrew Guckenberger ,  Thierry Pinguet ,  Sherif Abdalla

IPC: G02B6/42

CPC classification number: G02B6/4274 ,  G02B6/4286

Abstract: A method and system for implementing high-speed electrical interfaces between semiconductor dies in optical communication systems are disclosed and may include communicating electrical signals between a first die and a second die via coupling pads which may be located in low impedance points in Tx and Rx paths. The electrical signals may be communicated via one or more current-mode, controlled impedance, and/or capacitively-coupled interfaces. The current-mode interface may include a cascode amplifier stage split between source and drain terminals of transistors on the dies. The controlled-impedance interfaces may include transmission line drivers on a first die and transmission lines on a second die. The capacitively-coupled interfaces may include capacitors formed by contact pads on the dies. The coupling pads may be connected via one or more of: wire bonds, metal pillars, solder balls, or conductive resin. The dies may comprise CMOS and may be coupled in a flip-chip configuration.

公开(公告)号：US09548811B2

公开(公告)日：2017-01-17

申请号：US14196122

申请日：2014-03-04

Applicant: Luxtera, Inc.

Inventor： Daniel Kucharski ,  Brian Welch ,  Sherif Abdalla

IPC: G02B26/00 ,  G02F1/01 ,  H04B10/079 ,  G02F1/225 ,  H04B10/50 ,  H04B10/54 ,  G02B26/06 ,  G02F1/21 ,  G02B26/08

CPC classification number: H04B10/5161 ,  G02B26/06 ,  G02B26/0841 ,  G02F1/0121 ,  G02F1/225 ,  G02F1/2255 ,  G02F2001/212 ,  G02F2201/58 ,  H04B10/0795 ,  H04B10/505 ,  H04B10/5053 ,  H04B10/541

Abstract: Methods and systems for encoding multi-level pulse amplitude modulated signals using integrated optoelectronics are disclosed and may include generating a multi-level, amplitude-modulated optical signal utilizing an optical modulator driven by two or more of a plurality of electrical input signals. The optical modulator may configure levels in the multi-level amplitude modulated optical signal. Drivers may be coupled to the optical modulator, and the plurality of electrical input signals may be synchronized before being communicated to said drivers. Two or more of said plurality of electrical input signals may be selected utilizing one or more multiplexers. The one or more multiplexers may select an electrical input or a complement of the electrical input. Phase addition may be synchronized in a plurality of optical modulator elements in the optical modulator utilizing one or more electrical delay lines. The optical modulator may be integrated on a single substrate.

Abstract translation: 公开了使用集成光电子学来编码多级脉冲幅度调制信号的方法和系统，并且可以包括利用由多个电输入信号中的两个或多个驱动的光调制器来产生多电平调幅光信号。 光调制器可以配置多电平调幅光信号中的电平。 驱动器可以耦合到光调制器，并且多个电输入信号可以在被传送到所述驱动器之前被同步。 可以利用一个或多个多路复用器来选择所述多个电输入信号中的两个或更多个。 一个或多个多路复用器可以选择电输入或电输入的补码。 利用一个或多个电延迟线，相位相加可以在光调制器中的多个光调制器元件中同步。 光学调制器可以集成在单个基板上。