Abstract:
Provided is a structure with a conductive plug including a substrate, a first dielectric layer, an etch stop layer, a second dielectric layer, a conductive plug and a liner. The substrate has a conductive region therein. The first dielectric layer, the etch stop layer and the second dielectric layer are sequentially formed on the substrate and have at least one opening therethrough. Besides, the opening has a substantially vertical sidewall. The conductive plug fills in the opening and is electrically connected to the conductive region. The liner surrounds the upper portion of the conductive plug. A method of forming a structure with a conductive plug is further provided.
Abstract:
Provided is a structure with a conductive plug including a substrate, a first dielectric layer, an etch stop layer, a second dielectric layer, a conductive plug and a liner. The substrate has a conductive region therein. The first dielectric layer, the etch stop layer and the second dielectric layer are sequentially formed on the substrate and have at least one opening therethrough. Besides, the opening has a substantially vertical sidewall. The conductive plug fills in the opening and is electrically connected to the conductive region. The liner surrounds the upper portion of the conductive plug. A method of forming a structure with a conductive plug is further provided.
Abstract:
A method of fabricating wordlines in semiconductor memory structures is disclosed that eliminates stringers between wordlines while maintaining a stable distribution of threshold voltage. A liner is deposited before performing a wordline etch, and a partial wordline etch is then performed. Remaining portions of the liner are removed, and the wordline etch is completed to form gates having vertical or tapered profiles.
Abstract:
A method of fabricating wordlines in semiconductor memory structures is disclosed that eliminates stringers between wordlines while maintaining a stable distribution of threshold voltage. A liner is deposited before performing a wordline etch, and a partial wordline etch is then performed. Remaining portions of the liner are removed, and the wordline etch is completed to form gates having vertical or tapered profiles.