Wafer level centrifuge for MEMS stiction detection and screening system and method

    公开(公告)号:US09651473B2

    公开(公告)日:2017-05-16

    申请号:US14222575

    申请日:2014-03-21

    Applicant: mCube Inc.

    CPC classification number: G01N19/02 B81C99/005

    Abstract: A wafer level centrifuge (WLC) system and method of testing MEMS devices using the system. The wafer level centrifuge (WLC) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to two or more MEMS wafers via the base centrifuge system. Each of the two or more MEMS wafers can have one or more MEMS devices formed thereon. The two or more MEMS wafers can be provided in two or more wafer holding cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS wafers, which can include identifying stiction in one or more MEMS devices on the one or more MEMS wafers.

    Centrifuge MEMS stiction test system and method

    公开(公告)号:US10317333B2

    公开(公告)日:2019-06-11

    申请号:US14289494

    申请日:2014-05-28

    Applicant: MCube Inc.

    Abstract: A system for testing a device under a high gravitational force including a centrifuge with a rotating member and method of operation thereof. An operating power can be applied to a device, which can be coupled to the rotating member. The system can include a rotational control that can be coupled to the centrifuge. This rotational control can be configured to rotate the rotating member in response to a controlled number of revolutions per time period. The system can also include an analysis device for monitoring one or more signals from the device with respect to the controlled number of revolutions per time period. The analysis device can be configured to determine a stiction force associated with the DUT (Device Under Test) in response to the time-varying gravitational forces and to the one or more signals from the DUTs.

    Centrifuge MEMS stiction detection and screening system and method

    公开(公告)号:US09758374B2

    公开(公告)日:2017-09-12

    申请号:US14267864

    申请日:2014-05-01

    Applicant: mCube Inc.

    CPC classification number: B81C99/004 B81C99/0035 B81C99/005

    Abstract: A centrifuge screening system and method of testing MEMS devices using the system. The wafer level centrifuge screening system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to one or more MEMS components via the base centrifuge system. Each of the one or more MEMS components can have one or more MEMS devices formed thereon. The one or more MEMS components can be provided in one or more cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS components, which can include identifying stiction in one or more MEMS devices on the one or more MEMS components.

    Substrate curvature compensation methods and apparatus
    4.
    发明授权
    Substrate curvature compensation methods and apparatus 有权
    基板曲率补偿方法和装置

    公开(公告)号:US09291638B2

    公开(公告)日:2016-03-22

    申请号:US13745723

    申请日:2013-01-18

    Applicant: mCube Inc.

    Abstract: A method for providing acceleration data with reduced substrate-displacement bias includes receiving in an accelerometer an external acceleration, determining the acceleration data with reduced substrate displacement bias in a compensation portion in response to a first and a second displacement indicators from a MEMS transducer, and, in response to substrate compensation factors from a MEMS compensation portion, outputting the acceleration data with reduced substrate displacement bias, wherein the first displacement indicator and the second displacement indicator are determined by the MEMS transducer relative to a substrate in response to the external acceleration and to a substrate displacement, and wherein the substrate compensation factors are determined by the MEMS compensation portion relative to the substrate in response to the substrate displacement.

    Abstract translation: 用于提供具有减小的衬底位移偏置的加速度数据的方法包括在加速度计中接收外部加速度,响应于来自MEMS换能器的第一和第二位移指示器,在补偿部分中减小衬底位移偏置来确定加速度数据,以及 响应于来自MEMS补偿部分的衬底补偿因子,以减小的衬底位移偏压输出加速度数据,其中第一位移指示器和第二位移指示器响应于外部加速度由MEMS换能器相对于衬底确定,并且 到衬底位移,并且其中衬底补偿因子响应于衬底位移由MEMS补偿部分相对于衬底确定。

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