公开(公告)号：US10883027B2

公开(公告)日：2021-01-05

申请号：US16611250

申请日：2018-03-02

Applicant: MEC COMPANY LTD.

Inventor： Itsuro Tomatsu ,  Kosuke Kumazaki ,  Yasutaka Amitani ,  Yuko Shibanuma ,  Ikuyo Katayama

IPC: C09J179/02 ,  B32B15/08 ,  B32B15/20 ,  B32B37/12 ,  C09J5/02 ,  C09J11/04 ,  C23C22/06 ,  C23C22/63 ,  C23C22/68 ,  H05K3/38

Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.

公开(公告)号：US12157837B2

公开(公告)日：2024-12-03

申请号：US17310676

申请日：2020-01-09

Applicant: MEC COMPANY LTD.

Inventor： Tomoki Hayashi ,  Itsuro Tomatsu ,  Daisaku Akiyama

IPC: C09J11/06 ,  C09J11/04 ,  C08K3/16 ,  C08K3/30 ,  C08K5/3492

Abstract: An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.

公开(公告)号：US20220073793A1

公开(公告)日：2022-03-10

申请号：US17310676

申请日：2020-01-09

Applicant: MEC COMPANY LTD.

Inventor： Tomoki Hayashi ,  Itsuro Tomatsu ,  Daisaku Akiyama

IPC: C09J11/06 ,  C09J11/04

Abstract: An adhesive composition for forming an adhesive layer to be in contact with a resin on a surface of a metal, including: a low molecular weight organic compound having two or more nitrogen atoms in one molecule; and at least one metal ion selected from the group consisting of a trivalent aluminum ion and a trivalent chromium ion, wherein the resin is a curable resin, and the adhesive composition is an aqueous solution having a pH of 12 or less and has a concentration of the low molecular weight organic compound of 0.01 to 150 g/L and a molar concentration of the at least one metal ion of 0.005 to 100 mmol/L. The adhesive composition can improve adhesion between surfaces of multiple metals and a resin.

公开(公告)号：US10801112B2

公开(公告)日：2020-10-13

申请号：US16471126

申请日：2017-12-15

Applicant: MEC COMPANY LTD.

Inventor： Daisaku Akiyama ,  Itsuro Tomatsu ,  Yasutaka Amitani ,  Keisuke Joko ,  Tokuya Satomi

IPC: C23C22/05 ,  B32B15/08 ,  B32B15/20 ,  B32B37/12 ,  C08J5/12 ,  C23C22/18

Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.

公开(公告)号：US10329453B2

公开(公告)日：2019-06-25

申请号：US16096827

申请日：2017-03-13

Applicant: MEC COMPANY LTD.

Inventor： Daisaku Akiyama ,  Yoichi Sengoku ,  Itsuro Tomatsu ,  Masao Okada ,  Ryoko Mitani ,  Keisuke Joko ,  Yasutaka Amitani ,  Tokuya Satomi ,  Masaru Takahashi

IPC: C09D183/04 ,  B32B15/08 ,  C09J11/08 ,  C09J183/04 ,  C09D7/63

Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.