公开(公告)号：US20230282625A1

公开(公告)日：2023-09-07

申请号：US18107520

申请日：2023-02-09

Applicant: MEDIATEK INC.

Inventor： Ta-Jen Yu ,  Shih-Chin Lin ,  Tai-Yu Chen ,  Bo-Jiun Yang ,  Bing-Yeh Lin ,  Yung-Cheng Huang ,  Wen-Sung Hsu ,  Bo-Hao Ma ,  Isabella Song

IPC: H01L25/10 ,  H01L23/48 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L25/105 ,  H01L23/481 ,  H01L23/49866 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/48 ,  H01L2224/73204 ,  H01L2224/08112 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/183

Abstract: A semiconductor package includes a bottom substrate and a top substrate space apart from the bottom substrate such that the bottom substrate and the top substrate define a gap therebetween. A logic die is mounted on a top surface of the bottom substrate. The logic die has a thickness of 125-350 micrometers. A plurality of copper cored solder balls is disposed between the bottom substrate and the top substrate around the logic die to electrically connect the bottom substrate with the top substrate. A sealing resin fills into the gap between the bottom substrate and the top substrate and sealing the logic die and the plurality of copper cored solder balls in the gap.

公开(公告)号：US20180026451A1

公开(公告)日：2018-01-25

申请号：US15472235

申请日：2017-03-28

Applicant: MediaTek Inc.

Inventor： Chih-Yuan Hsiao ,  Chien-Tse Fang ,  Wei-Ting Wang ,  Yung-Cheng Huang ,  Jia-You Chuang

IPC: H02J7/00

CPC classification number: H02J7/007 ,  G06F1/206 ,  G06F1/26 ,  H02J7/00 ,  H02J7/0021 ,  H02J7/0068 ,  H02J7/04

Abstract: A mobile device performs thermal management during concurrent battery charging and workload execution based on a thermal headroom. The thermal headroom is an amount of power, in a form of heat, that heat dissipation hardware in the mobile device is estimated to dissipate when the mobile device operates at a target temperature. After the thermal headroom is determined, the mobile device determines a first power allocation to system loading, which is caused by one or more applications running on the mobile device. The first power allocation is subtracted from the thermal headroom to obtain a second power allocation to a charger, which charges a battery module of the mobile device while the one or more application are running. The mobile device then sets an input power limit of the charger based on the second power allocation.