公开(公告)号：US09755669B2

公开(公告)日：2017-09-05

申请号：US15250920

申请日：2016-08-30

Applicant: MediaTek Inc.

Inventor： Yen-Liang Chen ,  Chia-Sheng Peng ,  Da-Wei Sung

IPC: H04B17/00 ,  H04B1/04 ,  G01R19/04 ,  G01R31/28 ,  H03F1/32 ,  H03F1/02 ,  H03F3/195 ,  H03F3/24

CPC classification number: H04B1/04 ,  G01R19/04 ,  G01R31/2851 ,  H03F1/0216 ,  H03F1/3241 ,  H03F3/195 ,  H03F3/245 ,  H03F2200/102 ,  H03F2200/321 ,  H03F2200/451 ,  H04B2001/0425

Abstract: Techniques and examples pertaining to variation calibration for envelope tracking on chip are described. Envelope tracking (ET) statistics among multiple wireless-capable mobile devices (e.g., smartphones) may be collected in laboratory. Optimal ET parameters may be determined based on ET statistics. An ET setting file may be generated for ET factory calibration. In production lines, the ET setting file may be loaded into each mobile device for ET factory calibration.

公开(公告)号：US10673385B2

公开(公告)日：2020-06-02

申请号：US16040594

申请日：2018-07-20

Applicant: MEDIATEK Inc.

Inventor： Shih-Mei Lin ,  Che-Hao Meng ,  Da-Wei Sung ,  Chien-Wei Kuan

IPC: H03F3/217 ,  H03F1/02 ,  H02M3/158 ,  G05F1/565 ,  H02M3/335

Abstract: A supply modulator, a modulated power supply circuit, and associated control method are provided. The modulated power supply circuit includes the supply modulator and a DC-DC voltage converter, and the supply modulator includes a linear amplifier and a switching converter. The linear amplifier generates an AC component of a modulated voltage according to a regulated voltage and an envelope tracking signal. The supply voltage is converted to the regulated voltage by the DC-DC voltage converter, and the regulated voltage is greater than or less than the supply voltage. The switching converter includes a step-down circuit and a path selection circuit. The path selection circuit selects one of the supply voltage and the regulated voltage as a DC input voltage. The step-down circuit converts the DC input voltage to a DC component of the modulated voltage which is less than the DC input voltage.

公开(公告)号：US10483925B2

公开(公告)日：2019-11-19

申请号：US16053806

申请日：2018-08-03

Applicant: MEDIATEK INC.

Inventor： Sheng-Hong Yan ,  Da-Wei Sung ,  Chen-Yen Ho ,  Chia-Sheng Peng ,  Chien-Wei Kuan

IPC: H03F3/20 ,  H03F3/195 ,  H03F1/02 ,  H03F3/213 ,  H03F3/21 ,  H03F3/24

Abstract: A circuit module includes a power amplifier, a switch, and a bypass capacitor. The power amplifier has a signal input node coupled to an input signal, a signal output node to generate an output signal, and a power input node coupled to a supply output signal of a supply modulator. The switch is coupled between the power input node of the power amplifier and the bypass capacitor. The bypass capacitor is an equivalently removable bypass capacitor coupled between the switch and a ground level.

公开(公告)号：US20190052238A1

公开(公告)日：2019-02-14

申请号：US16053806

申请日：2018-08-03

Applicant: MEDIATEK INC.

Inventor： Sheng-Hong Yan ,  Da-Wei Sung ,  Chen-Yen Ho ,  Chia-Sheng Peng ,  Chien-Wei Kuan

IPC: H03F3/195 ,  H03F3/24 ,  H03F3/21

CPC classification number: H03F3/195 ,  H03F1/0211 ,  H03F1/0227 ,  H03F1/0238 ,  H03F3/211 ,  H03F3/213 ,  H03F3/245 ,  H03F2200/111 ,  H03F2200/213 ,  H03F2200/297 ,  H03F2200/411 ,  H03F2200/451 ,  H03F2203/21136 ,  H03F2203/21196 ,  H03F2203/7209

Abstract: A circuit module includes a power amplifier, a switch, and a bypass capacitor. The power amplifier has a signal input node coupled to an input signal, a signal output node to generate an output signal, and a power input node coupled to a supply output signal of a supply modulator. The switch is coupled between the power input node of the power amplifier and the bypass capacitor. The bypass capacitor is an equivalently removable bypass capacitor coupled between the switch and a ground level.

公开(公告)号：US20160373142A1

公开(公告)日：2016-12-22

申请号：US15250920

申请日：2016-08-30

Applicant: MediaTek Inc.

Inventor： Yen-Liang Chen ,  Chia-Sheng Peng ,  Da-Wei Sung

IPC: H04B1/04 ,  G01R31/28 ,  H04B17/11 ,  H03F1/02 ,  H03F3/195 ,  H03F3/213 ,  G01R19/04 ,  H03F1/32

CPC classification number: H04B1/04 ,  G01R19/04 ,  G01R31/2851 ,  H03F1/0216 ,  H03F1/3241 ,  H03F3/195 ,  H03F3/245 ,  H03F2200/102 ,  H03F2200/321 ,  H03F2200/451 ,  H04B2001/0425

Abstract: Techniques and examples pertaining to variation calibration for envelope tracking on chip are described. Envelope tracking (ET) statistics among multiple wireless-capable mobile devices (e.g., smartphones) may be collected in laboratory. Optimal ET parameters may be determined based on ET statistics. An ET setting file may be generated for ET factory calibration. In production lines, the ET setting file may be loaded into each mobile device for ET factory calibration.

Abstract translation: 描述了关于片上包络跟踪的变化校准的技术和示例。 可以在实验室收集多个无线能力的移动设备（例如，智能电话）之间的信封跟踪（ET）统计信息。 可以基于ET统计来确定最佳ET参数。 可以为ET工厂校准生成ET设置文件。 在生产线上，可以将ET设置文件加载到每个移动设备中进行ET工厂校准。