公开(公告)号：US11855468B2

公开(公告)日：2023-12-26

申请号：US18061578

申请日：2022-12-05

申请人： MILWAUKEE ELECTRIC TOOL CORPORATION

发明人： Wyatt R. Silha ,  Cameron R. Schulz ,  Kyle C. Fassbender ,  Zhi Wei Meng

IPC分类号： H01M10/46 ,  H02J7/00 ,  H05K1/18 ,  H01M10/44 ,  H05K7/20 ,  H05K1/02

CPC分类号： H02J7/0042 ,  H01M10/44 ,  H02J7/0013 ,  H02J7/0045 ,  H02J7/0047 ,  H02J7/00047 ,  H02J7/00309 ,  H05K1/0295 ,  H05K1/18 ,  H05K7/20154 ,  H05K7/20209 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10522

摘要： A battery charger may include a printed circuit board (PCB) having a first portion supporting alternating current (AC) electrical components and a second portion supporting direct current (DC) electrical components; an indicator including a light-emitting diode (LED) supported on the first portion of the PCB and operable to emit light; and an isolating member positioned on the first portion between the AC electrical components and the LED. A trace on the PCB may be electrically connected to the second portion of the PCB, the trace extending from the second portion and along the first portion, and the LED may be electrically connected to and receiving DC power through the trace, the LED being selectively positioned along a length of the trace. The LED may be positioned more than about 8 mm from the AC electrical components.

公开(公告)号：US20230309224A1

公开(公告)日：2023-09-28

申请号：US17899385

申请日：2022-08-30

申请人： KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION

发明人： Kazuyoshi AKUTSU

IPC分类号： H05K1/11 ,  H05K1/02 ,  G11B5/82

CPC分类号： H05K1/111 ,  H05K1/0295 ,  G11B5/82 ,  H05K2201/09954

摘要： According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.

公开(公告)号：US20190124758A1

公开(公告)日：2019-04-25

申请号：US16096907

申请日：2017-09-11

申请人： ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.

发明人： Junyang LI

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H01R12/57

CPC分类号： H05K1/0216 ,  H01R12/57 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/0295 ,  H05K1/036 ,  H05K1/115

摘要： A PCB and a signal transmission system are provided. The PCB includes a connection module, and at least two signal layers and at least two reference layers spaced apart. The connection module comprises a first connection terminal and a second connection terminal. The first connection terminal is connected to at least one first signal layer and is connectable to an external optical interface. The second connection terminal is connected to at least one second signal layer and is connectable to an external electrical interface. Each reference layers is provided with a through-hole, and for each reference layers, there is an overlapping region between a projection region of an orthogonal projection of the connection module onto the reference layer and a hole region of the through-hole arranged on the reference layer.

公开(公告)号：US10038264B2

公开(公告)日：2018-07-31

申请号：US15351237

申请日：2016-11-14

申请人： Microsoft Technology Licensing, LLC

发明人： David Lukofsky ,  Joseph Christopher Bolling ,  Jeffrey M. Quackenbush ,  Tapani von Rauner

IPC分类号： H01R12/00 ,  H01R12/91 ,  H01R12/78 ,  H01R12/72 ,  H04N13/04

CPC分类号： H01R12/91 ,  H01R12/721 ,  H01R12/78 ,  H04N13/344 ,  H04N2213/001 ,  H04N2213/008 ,  H05K1/0221 ,  H05K1/0295 ,  H05K1/11 ,  H05K3/361 ,  H05K2201/09272 ,  H05K2201/09381 ,  H05K2201/0939

摘要： A universal coupling is disclosed for electrically and mechanically connecting flexible printed circuit (FPC) components within asymmetric FPC modules. The universal coupling allows a first FPC component to be connected to a second FPC component in two or more different orientations. This allows identical FPC components to be used in two or more asymmetric FPC modules. This in turn allows a reduction in the number of parts and tooling required to fabricate the two or more asymmetric FPC modules, and a simplification of the fabrication process.

公开(公告)号：US09867285B2

公开(公告)日：2018-01-09

申请号：US14843000

申请日：2015-09-02

申请人： Apple Inc.

发明人： Paul A. Martinez ,  Tyler S. Bushnell ,  Jason C. Sauers

IPC分类号： H05K7/10 ,  H05K7/12 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC分类号： H05K1/0295 ,  H05K3/301 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/094 ,  H05K2201/09954 ,  H05K2201/1031 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

摘要： An electronic device may include surface mount technology components mounted to a printed circuit board. The surface mount technology components may include electrical components such as resistors, inductors, and capacitors. In order to reduce the size of the electronic device, surface mount technology components may be stacked. A surface mount technology component may be mounted to metal members that electrically connect the surface mount technology component to contact pads on a printed circuit board. A surface mount technology component may be provided with integral standoff portions, and a second surface mount technology component may be mounted to the integral standoff portions. A single surface mount technology component may be used to implement different circuits depending on which face of the surface mount technology component is mounted to the printed circuit board.

公开(公告)号：US20170347454A1

公开(公告)日：2017-11-30

申请号：US15450131

申请日：2017-03-06

申请人： TOSHIBA MEMORY CORPORATION

发明人： Shiro HARASHIMA

IPC分类号： H05K1/18 ,  H01R24/64

CPC分类号： H05K1/18 ,  H01R12/725 ,  H01R24/62 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0295 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/10159 ,  H05K2201/10189

摘要： According to an embodiment, an electronic device includes a substrate, first conductors, second conductors, a connector, third conductors, an electronic component, and a first wiring. The first conductor is complied with a first USB standard. The second conductor is complied with a second USB standard. The connector is mounted on the first conductors or the second conductors. The first wiring connects one of the first conductors, one of the second conductors, and one of the third conductors.

公开(公告)号：US20160148911A1

公开(公告)日：2016-05-26

申请号：US14903858

申请日：2014-07-08

申请人： PSI CO., LTD.

发明人： Young Rag Do

IPC分类号： H01L25/075 ,  H01L33/38 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

摘要： Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

摘要翻译： 提供了一种纳米级LED组件及其制造方法。 首先，独立制造的纳米级LED器件可以对准并连接到彼此不同的两个电极，以解决将具有纳米单元的纳米级LED器件耦合到彼此不同的两个电极的限制 站立状态。 此外，由于LED器件和电极设置在同一平面上，所以可以提高LED器件的光提取效率。 此外，可以调整纳米级LED器件的数量。 第二，由于纳米尺度的LED器件不能立即连接到上电极和下电极，而是要被连接到在同一平面上彼此不同的两个电极，所以光提取效率可以非常改善 。 此外，由于在LED器件的表面上形成单独的层以防止LED器件和电极电短路，所以可以使LED电极组件的缺陷最小化。 此外，为了准备LED装置的非常罕见的缺陷的发生，可以将多个LED器件连接到电极以保持纳米级LED电极组件的原始功能。

公开(公告)号：US20150359088A1

公开(公告)日：2015-12-10

申请号：US14759286

申请日：2013-12-17

申请人： SHARP KABUSHIKI KAISHA

发明人： Masahiro KONISHI ,  Yuhsuke FUJITA ,  Ippei YAMAGUCHI ,  Takashi NAKANISHI ,  Hiroyuki NOKUBO

IPC分类号： H05K1/02 ,  H05K1/18 ,  H01L33/64 ,  B23K1/00 ,  H01L33/62 ,  H05K1/05 ,  H05K3/34

CPC分类号： H05K1/0295 ,  B23K1/0016 ,  B23K1/008 ,  B23K2101/42 ,  F21V19/0055 ,  F21V29/70 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01R12/716 ,  H05K1/053 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10356 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00

摘要： A first land portion (2f) or a second land portion (2s) is formed on a board (1), and a first connector (20b) or a second connector (20s) is electrically connected while the first connector (20b) or the second connector (20s) is placed on the first land portion (2f) or the second land portion (2s).

摘要翻译： 第一接地部分（2f）或第二接地部分（2s）形成在板（1）上，并且第一连接器（20b）或第二连接器（20s）电连接，而第一连接器（20b）或 第二连接器（20s）被放置在第一接地部分（2f）或第二接地部分（2s）上。

公开(公告)号：US09204543B2

公开(公告)日：2015-12-01

申请号：US14094862

申请日：2013-12-03

申请人： Infineon Technologies AG

发明人： Peter Ossimitz

IPC分类号： H01L23/52 ,  H01L23/48 ,  H05K1/11 ,  H05K1/09 ,  H05K1/18 ,  H05K3/10

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0295 ,  H05K1/09 ,  H05K1/181 ,  H05K3/10 ,  H05K2201/09954 ,  H05K2201/10234 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49147 ,  H01L2924/014 ,  H01L2924/00014

摘要： An Integrated Circuit (IC) package comprises a package comprising a first set of pads having a pinout that is compatible with a chip core of a product family. A second set of pads are on substantially the same plane as the first set of pads and outside the package core. The second set of pads is configured to accommodate a circuit outside the chip core. The geometric center of the package core is different from the geometric center of the IC package.

摘要翻译： 集成电路（IC）封装包括包括具有与产品系列的芯片芯片兼容的引脚排列的第一组焊盘的封装。 第二组焊盘与第一组焊盘在基本相同的平面上，并且在封装芯之外。 第二组焊盘被配置为容纳芯片外部的电路。 封装芯的几何中心与IC封装的几何中心不同。

公开(公告)号：US09119304B2

公开(公告)日：2015-08-25

申请号：US13566291

申请日：2012-08-03

申请人： Yu-Sik Kim ,  Woo-Sung Han

发明人： Yu-Sik Kim ,  Woo-Sung Han

IPC分类号： H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L25/075

CPC分类号： H05K1/0295 ,  H01L25/0753 ,  H01L2224/16225 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173

摘要： A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.

摘要翻译： 提供一种适用于可安装在其上的设备的AC和DC操作的子座，包括这种子座的发光设备以及制造这种子座的方法。 子座包括具有第一表面和第二表面的基底基底，第一表面上的导电图案，第二表面上的第一和第二对第一和第二电极以及在第一和第二表面之间延伸穿过基底的通孔。 导电图案包括第一组安装部分和沿着第一对第一和第二电极之间的第一电路径的两个通孔部分，以及第二组安装部分和沿第二电路的第二组电路之间的两个通孔部分 第一和第二电极，通孔部分将导电图案的各个部分连接到相应的电极。