公开(公告)号：US11721971B2

公开(公告)日：2023-08-08

申请号：US16079382

申请日：2017-01-25

申请人： Frederic Vladimir Esposito

发明人： Frederic Vladimir Esposito

IPC分类号： H02H9/00 ,  G05B19/042 ,  H01R13/434 ,  H02H3/00 ,  H05K1/02

CPC分类号： H02H9/008 ,  G05B19/0428 ,  H01R13/434 ,  H02H3/006 ,  G05B2219/24028 ,  H05K1/029 ,  H05K1/0257 ,  H05K2201/0746 ,  H05K2201/09954 ,  Y02B70/30 ,  Y04S20/20

摘要： The present invention provides for an electronic isolator device for application in intrinsically safe environments having isolation and safety functionality and comprising: an isolator module (101), a safety module (100), and wherein the isolator module is arranged for removable physical/electrical connection to the safety module in at least two orientations/configurations (DO, Dl, Al, AO) relative to the safety module, wherein the electrical connection to the safety module in each of the at least two orientations/configurations serves to configure the electrical functionality of the safety module (100).

公开(公告)号：US20190223296A1

公开(公告)日：2019-07-18

申请号：US16295177

申请日：2019-03-07

申请人： U.S. Army Research Laboratory ATTN: CCRL-LOC-I

发明人： Jeffrey Spencer Pulskamp

IPC分类号： H05K3/30 ,  H01L27/20 ,  H01L41/09 ,  H05K1/02 ,  H02N2/00

CPC分类号： H05K3/303 ,  H01L27/20 ,  H01L41/094 ,  H02N2/0095 ,  H05K1/029 ,  H05K3/0008 ,  H05K2201/1009 ,  H05K2203/1509 ,  H05K2203/173 ,  Y02P70/613 ,  Y10T29/53174

摘要： A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

公开(公告)号：US20180053736A1

公开(公告)日：2018-02-22

申请号：US15795511

申请日：2017-10-27

申请人： ROHM CO., LTD.

发明人： Takuma SHIMOICHI ,  Yasuhiro KONDO

IPC分类号： H01L23/66 ,  H01L49/02 ,  H01L27/01

CPC分类号： H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

摘要： A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US09699896B2

公开(公告)日：2017-07-04

申请号：US14792878

申请日：2015-07-07

申请人： SEIKO EPSON CORPORATION

发明人： Hideki Takahashi

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18

CPC分类号： H05K1/029 ,  H05K1/0286 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/181 ,  H05K1/184 ,  H05K2201/093 ,  H05K2203/175

摘要： A substrate includes a first pattern on which terminals are formed; a second pattern on which terminals are formed; and a third pattern on which terminals are formed. A distance between a first pair of terminals which are configured by one terminal of the first pattern and one terminal of the second pattern is equal to a distance between a second pair of terminals which are configured by another terminal of the first pattern and one terminal of the third pattern, and a distance between a third pair of terminals which are configured by another of the terminals of the third pattern and another of the terminals of the second pattern is equal to a distance between a fourth pair of terminals which are configured by the other of the terminal of the third pattern and the other of the terminal of the first pattern.

公开(公告)号：US09679854B2

公开(公告)日：2017-06-13

申请号：US14619052

申请日：2015-02-10

申请人： Intel Corporation

发明人： Shaowu Huang ,  Beom-Taek Lee

IPC分类号： H01L23/538 ,  H04B3/36 ,  H04L25/20 ,  G06F1/18 ,  H05K1/02 ,  H05K1/14

CPC分类号： H01L23/5382 ,  G06F1/185 ,  H01L23/5389 ,  H04B3/36 ,  H04L25/20 ,  H05K1/029 ,  H05K1/14 ,  H05K1/144

摘要： The present disclosure is directed to a reconfigurable repeater system. A system may comprise a PCB to which devices are coupled. At least one communication channel may convey communications signals between the devices. At least one receptacle may also be coupled to the PCB and may intersect the at least one communication channel so as to separate the at least one communication channel into sections. Inserting at least one extender module into the at least one receptacle may couple the at least one extender module to the sections of the communication module. The at least one extender module may include at least one conductor to convey communication signals between the sections of the at least one communication channel. Another configuration of the at least one extender module may include a repeater to receive, amplify and transmit communication signals between the sections of the at least one communication channel.

公开(公告)号：US09490199B2

公开(公告)日：2016-11-08

申请号：US14194916

申请日：2014-03-03

申请人： Infineon Technologies AG

发明人： Theng Chao Long ,  Tian San Tan ,  Wan Yee Ng ,  Kong Sin Chong

IPC分类号： H01L23/498 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L23/49844 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2225/1017 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15331 ,  H01L2924/15333 ,  H01L2924/181 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/181 ,  H05K2201/0305 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2203/173 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions.

摘要翻译： 用于在半导体封装之间建立垂直连接的插入件包括具有第一主侧和与第一主侧相对的第二主侧的电绝缘基板，在基板的第一主侧的多个第一电导体，多个第二主体 在基板的第二主侧的电导体和在基板的一个或两个主侧的可编程连接矩阵。 可编程连接矩阵包括被配置为在编程接合点时打开或闭合不同的第一电导体和不同的第二电导体之间的电连接的可编程结。

公开(公告)号：US20160080333A1

公开(公告)日：2016-03-17

申请号：US14787848

申请日：2014-05-14

申请人： NEC CORPORATION

发明人： Toshiyuki ISSHIKI

IPC分类号： H04L29/06 ,  H04L9/30

CPC分类号： G06F1/3212 ,  G06F3/00 ,  G06F13/40 ,  H01L23/5382 ,  H01L2924/0002 ,  H04L9/3093 ,  H04L63/0442 ,  H04L2209/24 ,  H05K1/029 ,  H05K1/142 ,  H05K2201/10037 ,  H05K2201/10212 ,  Y02D10/174 ,  H01L2924/00

摘要： A collation system includes a first node, a second node and a third node. The first node includes: an encryption unit; a distance calculation unit t; and a collation data generation unit. The second node includes: a key generation unit; and a collation unit. The third node includes: a storage unit; and a collation information generation unit.

摘要翻译： 核对系统包括第一节点，第二节点和第三节点。 第一节点包括：加密单元; 距离计算单元t; 和核对数据生成单元。 第二节点包括：密钥生成单元; 和对照单元。 第三节点包括：存储单元; 和核对信息生成单元。

公开(公告)号：US20150249047A1

公开(公告)日：2015-09-03

申请号：US14194916

申请日：2014-03-03

申请人： Infineon Technologies AG

发明人： Theng Chao Long ,  Tian San Tan ,  Wan Yee Ng ,  Kong Sin Chong

IPC分类号： H01L23/498 ,  H01L25/065

CPC分类号： H01L23/49844 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73221 ,  H01L2225/1017 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/15331 ,  H01L2924/15333 ,  H01L2924/181 ,  H05K1/0287 ,  H05K1/029 ,  H05K1/181 ,  H05K2201/0305 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2203/173 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An interposer for establishing a vertical connection between semiconductor packages includes an electrically insulating substrate having a first main side and a second main side opposite the first main side, a plurality of first electrical conductors at the first main side of the substrate, a plurality of second electrical conductors at the second main side of the substrate, and a programmable connection matrix at one or both main sides of the substrate. The programmable connection matrix includes programmable junctions configured to open or close electrical connections between different ones of the first electrical conductors and different ones of the second electrical conductors upon programming of the junctions.

摘要翻译： 用于在半导体封装之间建立垂直连接的插入件包括具有第一主侧和与第一主侧相对的第二主侧的电绝缘基板，在基板的第一主侧的多个第一电导体，多个第二主体 在基板的第二主侧的电导体和在基板的一个或两个主侧的可编程连接矩阵。 可编程连接矩阵包括被配置为在编程接合点时打开或闭合不同的第一电导体和不同的第二电导体之间的电连接的可编程结。

公开(公告)号：US20140268591A1

公开(公告)日：2014-09-18

申请号：US14204800

申请日：2014-03-11

申请人： Nthdegree Technologies Worldwide Inc.

发明人： William Johnstone Ray ,  Richard Austin Blanchard ,  Mark David Lowenthal ,  Bradley Steven Oraw

IPC分类号： H05K1/02 ,  H01L25/00

CPC分类号： H01L24/95 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/06 ,  H01L24/24 ,  H01L24/25 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/0753 ,  H01L25/18 ,  H01L25/50 ,  H01L33/20 ,  H01L2221/68381 ,  H01L2224/06181 ,  H01L2224/24137 ,  H01L2224/25105 ,  H01L2224/25174 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82101 ,  H01L2224/82104 ,  H01L2224/82143 ,  H01L2224/92244 ,  H01L2224/95085 ,  H01L2224/95101 ,  H01L2224/95102 ,  H01L2224/95115 ,  H01L2224/95143 ,  H01L2224/95146 ,  H01L2924/10253 ,  H01L2924/12 ,  H01L2924/1203 ,  H01L2924/12041 ,  H01L2924/13 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13062 ,  H01L2924/13091 ,  H05K1/029 ,  H05K1/0296 ,  H05K3/12

摘要： A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

摘要翻译： 可编程电路包括微阵列晶体管或二极管的印刷组阵列。 这些装置被预先形成并印刷成油墨并固化。 每个组中的设备并联连接，以使每个组充当单个设备。 在一个实施例中，每个组中包含约10个设备，因此冗余使得每个组非常可靠。 每个组具有终止于衬底上的贴片区域中的至少一个电引线。 互连导体图案将贴片区域中的组的至少一些引线互连以产生用于通用电路的定制应用的逻辑电路。 这些组也可以互连成逻辑门，并且栅极引线终止于贴片区域。 然后，互连导体图案将形成复合逻辑电路的栅极互连。

公开(公告)号：US08739399B2

公开(公告)日：2014-06-03

申请号：US13455377

申请日：2012-04-25

申请人： Ronald Steven Cok ,  Christopher Lyons

发明人： Ronald Steven Cok ,  Christopher Lyons

IPC分类号： H05K3/30

CPC分类号： H05K1/029 ,  H01L23/5382 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/16238 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/25175 ,  H01L2224/82104 ,  H01L2224/82855 ,  H01L2924/12042 ,  H01L2924/1461 ,  H05K3/125 ,  H05K2201/10159 ,  H05K2203/173 ,  H05K2203/175 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A method of making an electronic storage system includes receiving a substrate and a circuit template. A transceiver including a transceiver substrate separate from the substrate is disposed over the substrate. The transceiver includes an output electrical-connection pad, and a plurality of input electrical-connection pads. A circuit template is disposed over the substrate so that at least one of the conductors of the circuit template is electrically connected to the output pad and at least one of the conductors of the circuit template is electrically connected to each of the input pads. At least one electrically-conductive strap is printed over the substrate so that each strap electrically connects the output pad to the at least one of the input pads through at least two of the conductors of the circuit template.

摘要翻译： 制造电子存储系统的方法包括接收基板和电路模板。 包括与基板分离的收发器基板的收发器设置在基板上。 收发器包括输出电连接焊盘和多个输入电连接焊盘。 电路模板设置在衬底上，使得电路模板的至少一个导体电连接到输出焊盘，并且电路模板的至少一个导体电连接到每个输入焊盘。 至少一个导电带被印刷在基板上，使得每个带通过电路模板的至少两个导体将输出焊盘电连接到至少一个输入焊盘。