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公开(公告)号:US20240019463A1
公开(公告)日:2024-01-18
申请号:US18469046
申请日:2023-09-18
Applicant: MICROFABRICA INC.
Inventor: MIchael S. Lockard , Stefano Felici , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/06744 , G01R1/06761 , G01R1/07357
Abstract: Forming buckling beam probe arrays having MEMS probes engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed is disclosed. Probes can be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement can occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Arrays can include probes and a substrate to which the probes are bonded with one or more guide plates. Final arrays can include probes held by guide plates with aligned or laterally shifted hole patterns.
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公开(公告)号:US20240061017A1
公开(公告)日:2024-02-22
申请号:US18469263
申请日:2023-09-18
Applicant: MICROFABRICA INC.
Inventor: MIchael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/07378 , G01R3/00 , G01R1/06761
Abstract: Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and/or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and/or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.
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