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公开(公告)号：US12196781B2
公开(公告)日：2025-01-14
申请号：US17968552
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US12066462B2
公开(公告)日：2024-08-20
申请号：US17507598
申请日：2021-10-21
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.
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公开(公告)号：US20240103042A1
公开(公告)日：2024-03-28
申请号：US17967548
申请日：2022-10-17
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20240094256A1
公开(公告)日：2024-03-21
申请号：US17968552
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US20240044939A1
公开(公告)日：2024-02-08
申请号：US18382406
申请日：2023-10-20
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
IPC: G01R1/067
CPC classification number: G01R1/06722
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.
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Patent Agency Ranking
公开(公告)号：US11828775B1
公开(公告)日：2023-11-28
申请号：US17320173
申请日：2021-05-13
Applicant: Microfabrica Inc.
Inventor： Michael S. Lockard , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/07378 , G01R1/06761 , G01R3/00
Abstract: Probe arrays include spacers attached to the probes that were formed along with the probes. Methods of making probe arrays by (1) forming probes on their sides and possibly as linear arrays or combination subarrays (e.g. as a number of side-to-side joined linear arrays) having probes fixed in array positions by a sacrificial material that is temporarily retained after formation of the probes; (2) assembling the probe units into full array configurations using the spacers attached to the probes or using alternative alignment structures to set the spacing and/or alignment of the probe(s) of one unit with another unit; and (3) fixing the probes in their configurations (e.g. bonding to a substrate and/or engaging the probes with one or more guide plates) wherein the spacers are retained or are removed, in whole or in part, prior to putting the array to use.
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公开(公告)号：US11821918B1
公开(公告)日：2023-11-21
申请号：US17240962
申请日：2021-04-26
Applicant: Microfabrica Inc.
Inventor： Michael S. Lockard , Stefano Felici , Uri Frodis , Dennis R. Smalley
CPC classification number: G01R1/06744 , G01R1/06761 , G01R1/07357
Abstract: Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed. In other embodiments, probes may be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement may occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Final arrays may include probes and a substrate to which the probes are bonded along with one or more guide plates while in other embodiments final arrays may include probes held by a plurality of guide plates (e.g. 2, 3, 4 or even more guide plates) with aligned or laterally shifted hole patterns.
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公开(公告)号：US20230324435A1
公开(公告)日：2023-10-12
申请号：US18299648
申请日：2023-04-12
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Uri Frodis , Heath A. Jensen
CPC classification number: G01R1/06722 , G01R1/06738 , G01R1/07314 , G01R1/06744 , G01R3/00 , G01R1/06761
Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.
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公开(公告)号：US11768227B1
公开(公告)日：2023-09-26
申请号：US17727336
申请日：2022-04-22
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
CPC classification number: G01R1/07357 , G01R1/06716 , G01R31/2863 , H01R13/2471 , H01R2201/20
Abstract: Embodiments are directed to probes formed from multiple layers with at least a portion of the layers including portions that include elastic compliant regions of the probes wherein such elastic portions of different layers are formed of different materials and wherein a plane of preferred elastic deformation of the probes is parallel to a plane containing (1) a normal to the planes of the layers and (2) a longitudinal axes of the probes or a local longitudinal axes of the probes.
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公开(公告)号：US11145947B2
公开(公告)日：2021-10-12
申请号：US16711116
申请日：2019-12-11
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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