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    Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
    2.
    发明授权
    Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions 有权

    公开(公告)号：US11821918B1

    公开(公告)日：2023-11-21

    申请号：US17240962

    申请日：2021-04-26

    Applicant: Microfabrica Inc.

    Inventor： Michael S. Lockard ,  Stefano Felici ,  Uri Frodis ,  Dennis R. Smalley

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/06744 ,  G01R1/06761 ,  G01R1/07357

    Abstract: Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed. In other embodiments, probes may be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement may occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Final arrays may include probes and a substrate to which the probes are bonded along with one or more guide plates while in other embodiments final arrays may include probes held by a plurality of guide plates (e.g. 2, 3, 4 or even more guide plates) with aligned or laterally shifted hole patterns.

    Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates
    7.
    发明授权
    Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates 有权

    公开(公告)号：US10676836B2

    公开(公告)日：2020-06-09

    申请号：US16118267

    申请日：2018-08-30

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

    IPC: C25D5/02 ,  B81C1/00 ,  C25D1/00 ,  C23C18/16

    Abstract: Some embodiments are directed to techniques for building single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while others use an intervening adhesion layer material. Some embodiments use different seed layer and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while others apply the materials in blanket fashion. Some embodiments remove extraneous material via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

    Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks
    10.
    发明申请
    Methods and Apparatus for Forming Multi-Layer Structures Using Adhered Masks 审中-公开
    使用粘附掩模形成多层结构的方法和装置

    公开(公告)号：US20140326607A1

    公开(公告)日：2014-11-06

    申请号：US14203409

    申请日：2014-03-10

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Jill R. Thomassian ,  Michael S. Lockard ,  Marvin M. Kilgo, III ,  Uri Frodis ,  Dennis R. Smalley

    IPC: C25D5/02

    CPC classification number: C25D1/003 ,  C25D1/00 ,  C25D1/20 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  C25D5/14 ,  C25D5/48 ,  C25D5/50

    Abstract: Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

    Abstract translation: 提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个 或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。 材料可以包括以无电解方式电沉积或沉积的导电材料。 在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

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