STT-MRAM cell structure incorporating piezoelectric stress material
    1.
    发明授权
    STT-MRAM cell structure incorporating piezoelectric stress material 有权
    STT-MRAM电池结构结合压电应力材料

    公开(公告)号:US09552858B2

    公开(公告)日:2017-01-24

    申请号:US14947978

    申请日:2015-11-20

    Abstract: A magnetic memory cell including a piezoelectric material, and methods of operating the memory cell are provided. The memory cell includes a stack, and the piezoelectric material may be formed as a layer in the stack or adjacent the layers of the cell stack. The piezoelectric material may be used to induce a transient stress during programming of the memory cell to reduce the critical switching current of the memory cell.

    Abstract translation: 提供了包括压电材料的磁存储单元和操作存储单元的方法。 存储单元包括堆叠,并且压电材料可以形成为堆叠中的层或邻近电池堆的层。 压电材料可以用于在编程存储器单元期间引起瞬态应力以减小存储器单元的关键开关电流。

    SPACER PROCESS FOR ON PITCH CONTACTS AND RELATED STRUCTURES
    2.
    发明申请
    SPACER PROCESS FOR ON PITCH CONTACTS AND RELATED STRUCTURES 审中-公开
    用于触点接触和相关结构的间隔工艺

    公开(公告)号:US20140299997A1

    公开(公告)日:2014-10-09

    申请号:US14311696

    申请日:2014-06-23

    Abstract: Methods are disclosed, including for increasing the density of isolated features in an integrated circuit. Also disclosed are associated structures. In some embodiments, contacts are formed on pitch with other structures, such as conductive interconnects that may be formed by pitch multiplication. To form the contacts, in some embodiments, a pattern corresponding to some of the contacts is formed in a selectively definable material such as photoresist. Features in the selectively definable material are trimmed, and spacer material is blanket deposited over the features and the deposited material is then etched to leave spacers on sides of the features. The selectively definable material is removed, leaving a mask defined by the spacer material. The pattern defined by the spacer material may be transferred to a substrate, to form on pitch contacts. In some embodiments, the on pitch contacts may be used to electrically contact conductive interconnects in the substrate.

    Abstract translation: 公开了包括用于增加集成电路中的隔离特征的密度的方法。 还公开了相关联的结构。 在一些实施例中,触点是与其他结构形成的,例如可以由间距倍增形成的导电互连。 为了形成触点,在一些实施例中,对应于一些触点的图案形成在诸如光致抗蚀剂的可选择定义的材料中。 在可选择定义的材料中的特征被修整,并且间隔物材料被毯子沉积在特征上,然后蚀刻沉积的材料以在特征的侧面留下间隔物。 去除可选择定义的材料,留下由间隔物材料限定的掩模。 由间隔物材料限定的图案可以转移到基底上,以形成间距接触。 在一些实施例中,上电触点可用于电接触衬底中的导电互连。

    STT-MRAM cell structure incorporating piezoelectric stress material
    3.
    发明授权
    STT-MRAM cell structure incorporating piezoelectric stress material 有权
    STT-MRAM电池结构结合压电应力材料

    公开(公告)号:US09218863B2

    公开(公告)日:2015-12-22

    申请号:US13673130

    申请日:2012-11-09

    Abstract: A magnetic memory cell including a piezoelectric material, and methods of operating the memory cell are provided. The memory cell includes a stack, and the piezoelectric material may be formed as a layer in the stack or adjacent the layers of the cell stack. The piezoelectric material may be used to induce a transient stress during programming of the memory cell to reduce the critical switching current of the memory cell.

    Abstract translation: 提供了包括压电材料的磁存储单元和操作存储单元的方法。 存储单元包括堆叠,并且压电材料可以形成为堆叠中的层或邻近电池堆的层。 压电材料可以用于在编程存储器单元期间引起瞬态应力以减小存储器单元的关键开关电流。

    STT-MRAM CELL STRUCTURE INCORPORATING PIEZOELECTRIC STRESS MATERIAL
    4.
    发明申请
    STT-MRAM CELL STRUCTURE INCORPORATING PIEZOELECTRIC STRESS MATERIAL 有权
    STT-MRAM结构与压电应力材料

    公开(公告)号:US20130064011A1

    公开(公告)日:2013-03-14

    申请号:US13673130

    申请日:2012-11-09

    Abstract: A magnetic memory cell including a piezoelectric material, and methods of operating the memory cell are provided. The memory cell includes a stack, and the piezoelectric material may be formed as a layer in the stack or adjacent the layers of the cell stack. The piezoelectric material may be used to induce a transient stress during programming of the memory cell to reduce the critical switching current of the memory cell.

    Abstract translation: 提供了包括压电材料的磁存储单元和操作存储单元的方法。 存储单元包括堆叠,并且压电材料可以形成为堆叠中的层或邻近电池堆的层。 压电材料可以用于在编程存储器单元期间引起瞬态应力以减小存储器单元的关键开关电流。

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