公开(公告)号：US20190001654A1

公开(公告)日：2019-01-03

申请号：US15639581

申请日：2017-06-30

申请人： Microsoft Technology Licensing, LLC

发明人： James Michael BONICATTO ,  Han LI ,  David John HUSTON ,  James David HOLBERY ,  Siyuan MA

IPC分类号： B32B43/00 ,  B32B41/00

CPC分类号： B32B43/006 ,  B32B41/00 ,  B32B2315/08 ,  B32B2457/208 ,  G02F2001/133331 ,  G02F2202/28 ,  G06F1/1637 ,  G06F3/0412 ,  Y10S156/924 ,  Y10T156/1158 ,  Y10T156/1917

摘要： Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.

公开(公告)号：US20160273564A1

公开(公告)日：2016-09-22

申请号：US14664391

申请日：2015-03-20

申请人： MICROSOFT TECHNOLOGY LICENSING, LLC

发明人： James Michael BONICATTO ,  Andrew William HILL ,  Nathan Michael THOME ,  John GODFREY ,  Robyn MCLAUGHLIN ,  Santosh SHETTY

IPC分类号： F16B5/00 ,  H05K7/14 ,  H05K13/00

CPC分类号： F16B5/00 ,  H01R12/7047 ,  H05K3/30 ,  H05K7/1407 ,  H05K7/1417 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y02P70/611

摘要： Examples of the disclosure enable a printed circuit board to be coupled to a chassis. In some examples, a coupling mechanism includes a first body including a head portion and a shaft portion that has an inner surface defining a channel. The coupling mechanism includes a second body including a head portion and a shaft portion. At least a part of the second body shaft portion is positionable within the channel. An outer surface of the second body shaft portion is sized to enable the second body shaft portion to expand radially or move laterally within the channel when the part of the second shaft portion is positioned within the channel. Examples of the disclosure enable the printed circuit board to be coupled to a chassis in low-profile, reduced-stress manner.

摘要翻译： 本公开的示例使得印刷电路板能够耦合到底架。 在一些示例中，联接机构包括包括头部和具有限定通道的内表面的轴部的第一主体。 联接机构包括包括头部和轴部的第二主体。 第二主体轴部分的至少一部分可定位在通道内。 第二主体轴部分的外表面的尺寸设定成使得当第二轴部分的部分位于通道内时，第二主体轴部能够在通道内径向扩张或横向移动。 本公开的实例使得印刷电路板能够以低调，低应力的方式耦合到底盘。