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公开(公告)号：US11881546B2
公开(公告)日：2024-01-23
申请号：US16705203
申请日：2019-12-05
发明人： Li-Yi Chen
摘要： A device with a light-emitting diode includes a substrate, a first conductive pad and a second conductive pad, a light-emitting diode, a metal protrusion, a polymer layer, and a top electrode. The substrate has a top surface. The first conductive pad and the second conductive pad are on the substrate. The light-emitting diode is on the first conductive pad. The metal protrusion is on the second conductive pad. The polymer layer covers the top surface of the substrate, the first conductive pad, the second conductive pad, the metal protrusion, and the light-emitting diode, in which a distance from a top of the metal protrusion to the top surface of the substrate is greater than a thickness of the polymer layer. The top electrode covers the light-emitting diode, the polymer layer, and the metal protrusion such that the light-emitting diode is electrically connected with the second conductive pad.
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公开(公告)号：US11189771B2
公开(公告)日：2021-11-30
申请号：US16711417
申请日：2019-12-11
发明人： Li-Yi Chen
IPC分类号： H01L33/64 , H01L33/52 , H01L25/075 , H01L33/62 , G06F1/16
摘要： A micro light emitting diode display includes a substrate, an electrode layer and a micro light emitting diode device. The substrate has a first surface, a second surface opposite to the first surface, and at least one air passage extending from the first surface to the second surface. The electrode layer is disposed on and in contact with the first surface of the substrate. The air passage has an opening on the first surface of the substrate, and the electrode layer is spaced apart from the opening. The micro light emitting diode device is disposed on the electrode layer and has a light emitting area that is less than or equal to 2500 μm2.
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公开(公告)号：US11062932B2
公开(公告)日：2021-07-13
申请号：US16706775
申请日：2019-12-08
发明人： Li-Yi Chen
IPC分类号： H01L21/683 , H01L25/075 , H01L33/62
摘要： A method of transferring a plurality of micro devices is provided. The method includes: arranging the micro devices on a carrier substrate in a hexagonal manner; arranging a plurality of pick-up portions of a transfer head in a rectangular manner; and picking up the micro devices from the carrier substrate by the pick-up portions.
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公开(公告)号：US11031272B2
公开(公告)日：2021-06-08
申请号：US16181364
申请日：2018-11-06
发明人： Li-Yi Chen
IPC分类号： H02N13/00 , H01L21/683 , B32B15/08 , B32B27/20
摘要： An electrostatic chuck including a body, an electrode, a diffusion blocking layer, and a composite dielectric layer is provided. The electrode is present on the body. The diffusion blocking layer is present on the electrode. The composite dielectric layer is present on the diffusion blocking layer. The composite dielectric layer includes a polymer layer and a plurality of inorganic dielectric particles. The plurality of inorganic dielectric particles is distributed within the polymer layer, and a permittivity of the inorganic dielectric particles is greater than a permittivity of the polymer layer.
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公开(公告)号：US10930528B2
公开(公告)日：2021-02-23
申请号：US16391331
申请日：2019-04-23
发明人： Shyh-Feng Chen , Li-Yi Chen , Fang-Chi Chien
IPC分类号： H01L21/67 , H01L23/00 , B65G47/90 , H01L21/677
摘要： A method for transferring a micro device includes: preparing a carrier substrate with the micro device thereon in which an adhesive layer is present between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon; forming a liquid layer on a receiving substrate; reducing the grip force of the force-adjustable glue layer of the transfer head to be smaller than a force attaching the micro device to the receiving substrate; placing the micro device over the receiving substrate such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.
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公开(公告)号：US10916518B2
公开(公告)日：2021-02-09
申请号：US16390018
申请日：2019-04-22
发明人： Li-Yi Chen
IPC分类号： H01L23/00 , H01L23/495
摘要： An electrical binding structure is provided, which includes a substrate, a contact pad set, and a combination of a micro device and an electrode. The contact pad set is on the substrate in which the contact pad set includes at least one contact pad, and the at least one contact pad is conductive. The combination is on the contact pad set. Opposite sides of the electrode are respectively in contact with the micro device and the contact pad set in which at least the contact pad set and the electrode define at least one volume space. A vertical projection of the at least one volume space on the substrate is overlapped with a vertical projection of one of the contact pad set and the electrode on the substrate, and is enclosed by a vertical projection of an outer periphery of the micro device on the substrate.
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公开(公告)号：US10340307B1
公开(公告)日：2019-07-02
申请号：US15849628
申请日：2017-12-20
发明人： Li-Yi Chen
摘要： A light-emitting diode includes semiconductor layers and electrodes. A first type semiconductor layer includes first and second low resistance portions and a high resistance portion therebetween. The high resistance portion encloses the first low resistance portion and is configured to confine charge carriers substantially within the first low resistance portion. A resistivity of the first type semiconductor layer increases from the first low resistance portion toward the high resistance portion and decreases from the high resistance portion toward the second low resistance portion. A first electrode is electrically connected to the first low resistance portion and substantially no current flows between the first electrode and the second low resistance portion. A portion of the first type semiconductor layer is between the first electrode and a second type semiconductor layer. A second electrode is electrically connected to the second type semiconductor layer.
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公开(公告)号：US10325889B1
公开(公告)日：2019-06-18
申请号：US15869094
申请日：2018-01-12
发明人： Li-Yi Chen
IPC分类号： H01L25/075 , H01L33/54 , H01L33/62 , H01L33/42
摘要： A display device includes a substrate, at least one bonding electrode, at least one LED device electrically connected to the bonding electrode, and a transparent conductive layer. The bonding electrode is between the LED device and the substrate. The LED device includes a n type semiconductor layer, a p type semiconductor layer between the n type semiconductor layer and the bonding electrode, and an intermediate layer. The p type semiconductor layer includes a high resistance portion and a low resistance portion enclosed by the high resistance portion. A resistivity of the p type semiconductor layer increases from the low resistance portion toward the high resistance portion. The intermediate layer is between the p type semiconductor layer and the bonding electrode. The transparent conductive layer is electrically connected to the n type semiconductor layer. The LED device is between the transparent conductive layer and the bonding electrode.
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公开(公告)号：US10312218B1
公开(公告)日：2019-06-04
申请号：US16040558
申请日：2018-07-20
发明人： Li-Yi Chen
摘要： A method for binding a micro device to a substrate is provided. The method includes: locally showering a gas on a portion of the substrate, wherein the gas has a water vapor pressure higher than an ambient water vapor pressure; and placing the micro device over the portion of the substrate after a part of water in the gas is condensed to form a liquid layer on the portion of the substrate and contacting the micro device with the liquid layer, so that the micro device is gripped by a capillary force produced by the liquid layer and is substantially held in a position within a controllable region on the substrate.
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公开(公告)号：US10236195B1
公开(公告)日：2019-03-19
申请号：US15847942
申请日：2017-12-20
发明人： Li-Yi Chen , Shih-Chyn Lin
IPC分类号： H01L21/67 , H01L21/683 , H01L21/78 , H01L25/075
摘要： A method for transferring a device includes the following steps: forming a pliable adhesive layer on a carrier substrate; placing the device over the pliable adhesive layer; contacting a transfer head assembly with the device, in which a pliable dielectric layer of the transfer head assembly is in contact with the device during the contacting and more pliable than the device, such that the pliable dielectric layer of the transfer head assembly deforms during the contacting, and the pliable adhesive layer is more pliable than the device, such that the pliable adhesive layer deforms during the contacting; actuating the transfer head assembly to create a grip force; picking up the device by the grip force created by the transfer head assembly; and placing the device onto a receiving substrate.
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