公开(公告)号：US20160312027A1

公开(公告)日：2016-10-27

申请号：US15104626

申请日：2014-12-19

Applicant: MITSUI CHEMICALS, INC.

Inventor： Kaoru MINAGAWA ,  Hiroki EBATA ,  Isao WASHIO ,  Kouichi SANO ,  Nobuhiro TAKIZAWA ,  Akinori AMANO

IPC: C08L77/06

CPC classification number: C08L77/06 ,  C08G69/265 ,  C08K7/14 ,  C08L51/06 ,  C08L2201/08 ,  C08L2205/06

Abstract: The problem of the invention is to provide a semi-aromatic polyamide resin composition having high rigidity, exceptional impact resistance, and exceptional zygosity with very little change in hardness associated with heating and cooling, as well as a molded article of this semi-aromatic polyamide resin composition. A semi-aromatic polyamide resin composition containing a semi-aromatic polyamide resin (A), acid-modified polyolefin resin (B), and fibrous filler (C), wherein the resin (A) contains a certain amount or more of terephthalic acid component units relative to the total number of moles of dicarboxylic acid component units, the semi-aromatic polyamide resin composition contains a certain amount or more of the resin (B), the glass transition temperature of the semi-aromatic polyamide resin composition is within a predetermined range, and the Vicat softening point of the resin (B) is within a predetermined range, is used as the semi-aromatic polyamide resin composition in order to solve this problem.

Abstract translation: 本发明的问题在于提供具有高刚性，优异的耐冲击性和极好的接合性，与加热和冷却相关的硬度变化很小的半芳族聚酰胺树脂组合物，以及这种半芳族聚酰胺的模塑制品 树脂组合物。 含有半芳族聚酰胺树脂（A），酸改性聚烯烃树脂（B）和纤维状填料（C）的半芳族聚酰胺树脂组合物，其中，树脂（A）含有一定量以上的对苯二甲酸成分 相对于二羧酸成分单元的总摩尔数的单位，半芳香族聚酰胺树脂组合物含有一定量以上的树脂（B），半芳香族聚酰胺树脂组合物的玻璃化转变温度在预定的 范围，并且树脂（B）的维卡软化点在预定范围内，用作半芳族聚酰胺树脂组合物以解决该问题。

公开(公告)号：US20200254728A1

公开(公告)日：2020-08-13

申请号：US16758475

申请日：2018-10-25

Applicant: MITSUI CHEMICALS, INC.

Inventor： Masaki MISUMI ,  Kazuki KIMURA ,  Kaoru MINAGAWA

IPC: B32B15/088 ,  B32B27/20 ,  B32B3/30 ,  B32B27/34 ,  B32B15/20 ,  B29C45/14 ,  C08L77/06

Abstract: A metal/resin composite structure includes: a metal member (M) having a fine uneven surface; and a polyamide-based resin member (A) bonded to the metal member (M), and the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]:[A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) is equal to or higher than 85° C. and equal to or lower than 140° C.; and[A2] a crystallization temperature (Tc) observed by a differential scanning calorimeter (DSC) is equal to or higher than 250° C. and equal to or lower than 292° C.