Heat structure for thermal mitigation

    公开(公告)号:US11165131B2

    公开(公告)日:2021-11-02

    申请号:US16838664

    申请日:2020-04-02

    摘要: Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

    Managing Antenna Module Heat and RF Emissions

    公开(公告)号:US20210234258A1

    公开(公告)日:2021-07-29

    申请号:US16751777

    申请日:2020-01-24

    摘要: In aspects of managing antenna module heat and RF emissions, an antenna module includes antenna elements that emit radio frequency (RF) signals for wireless data communication. The antenna module also includes an integrated heat sink to dissipate heat generated by an amplifier on the antenna module, where the heat sink is formed as a metallic component having a surface approximately coplanar with the antenna elements. The antenna module also includes one or more grooves that are formed into the surface of the heat sink, where the one or more grooves are effective to allow the RF signals being emitted from the antenna elements without deformation of a radiation pattern of the RF signals.

    Heat Structure for Thermal Mitigation

    公开(公告)号:US20210288392A1

    公开(公告)日:2021-09-16

    申请号:US16838664

    申请日:2020-04-02

    摘要: Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

    METHOD AND SYSTEM FOR A RECONFIGURABLE OVER-INDEXED ANTENNA ARRAY
    6.
    发明申请
    METHOD AND SYSTEM FOR A RECONFIGURABLE OVER-INDEXED ANTENNA ARRAY 有权
    可重复导向的天线阵列的方法和系统

    公开(公告)号:US20170005707A1

    公开(公告)日:2017-01-05

    申请号:US14927674

    申请日:2015-10-30

    IPC分类号: H04B7/04 H04B7/06 H01Q21/06

    摘要: A method and system for reconfiguring over-indexed antenna arrays in mobile devices are provided. For example, the method includes receiving sensor input that indicates an object blocking a first subset of reconfigurable antenna elements but not blocking a second subset of reconfigurable antenna elements of an over-indexed antenna array. The method also includes configuring, based on the sensor input, a number of the antenna elements in the first subset as non-active for radiating energy and a number of the antenna elements in the second subset as active for radiating energy.

    摘要翻译: 提供了一种用于在移动设备中重新配置过索引天线阵列的方法和系统。 例如,该方法包括接收传感器输入,该传感器输入指示对象阻挡可重构天线元件的第一子集,但不阻塞过索引天线阵列的可重构天线元件的第二子集。 该方法还包括基于传感器输入将第一子集中的多个天线元件配置为非有效辐射能量,并且将第二子集中的多个天线元件用作辐射能量。