公开(公告)号：US20240271307A1

公开(公告)日：2024-08-15

申请号：US18568465

申请日：2022-05-25

Applicant: MacDermid Enthone Inc.

Inventor： Donald Desalvo ,  Ron Blake ,  Carmichael Gugliotti ,  William J. Decesare ,  Richard A. Bellemare ,  James Watkowski ,  Ernest Long

IPC: C25D5/18 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  H05K3/42

CPC classification number: C25D5/18 ,  C25D3/38 ,  C25D5/02 ,  C25D7/00 ,  H05K3/421 ,  H05K3/424

Abstract: A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon: (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating. DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.