Method of manufacturing metal silicide and semiconductor structure using the same
    1.
    发明授权
    Method of manufacturing metal silicide and semiconductor structure using the same 有权
    使用其制造金属硅化物和半导体结构的方法

    公开(公告)号:US08969202B2

    公开(公告)日:2015-03-03

    申请号:US14174931

    申请日:2014-02-07

    Abstract: A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is provided. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates.

    Abstract translation: 以下公开了金属硅化物的制造方法。 提供具有第一区域和第二区域的衬底。 在衬底上形成硅层。 进行平面化处理以使硅层具有平坦表面。 去除硅层的一部分以在第一区域上形成多个第一栅极,并在第二区域上形成多个第二栅极。 第一栅极的高度大于第二栅极的高度,并且第一栅极和第二栅极的顶表面具有相同的高度水平。 覆盖第一栅极和第二栅极的电介质层形成并露出第一栅极和第二栅极的顶表面。 金属硅化物形成在第一栅极和第二栅极的顶表面上。

    METHOD OF MANUFACTURING METAL SILICIDE AND SEMICONDUCTOR STRUCTURE USING THE SAME
    2.
    发明申请
    METHOD OF MANUFACTURING METAL SILICIDE AND SEMICONDUCTOR STRUCTURE USING THE SAME 有权
    使用其制造金属硅化物和半导体结构的方法

    公开(公告)号:US20140154881A1

    公开(公告)日:2014-06-05

    申请号:US14174931

    申请日:2014-02-07

    Abstract: A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is provided. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates.

    Abstract translation: 以下公开了金属硅化物的制造方法。 提供具有第一区域和第二区域的衬底。 在衬底上形成硅层。 进行平面化处理以使硅层具有平坦表面。 去除硅层的一部分以在第一区域上形成多个第一栅极,并在第二区域上形成多个第二栅极。 第一栅极的高度大于第二栅极的高度,并且第一栅极和第二栅极的顶表面具有相同的高度水平。 覆盖第一栅极和第二栅极的电介质层形成并露出第一栅极和第二栅极的顶表面。 金属硅化物形成在第一栅极和第二栅极的顶表面上。

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