公开(公告)号：US20110073292A1

公开(公告)日：2011-03-31

申请号：US12571265

申请日：2009-09-30

申请人： Madhav Datta ,  Peng Zhou ,  Hae-won Choi ,  Brandon Leong ,  Mark McMaster ,  Douglas E. Werner

发明人： Madhav Datta ,  Peng Zhou ,  Hae-won Choi ,  Brandon Leong ,  Mark McMaster ,  Douglas E. Werner

IPC分类号： F28F9/00 ,  F28F9/24 ,  B21D53/02

CPC分类号： F28F1/40 ,  F28F3/02 ,  F28F2260/02 ,  F28F2275/04 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.

摘要翻译： 本发明提供了在流体冷却系统中实现高热传递的方法和装置，并且在整个系统上具有小的压降。 本发明教导了在热交换器的翅片上使用壁特征来冷却流体冷却系统中的流体。 本发明还公开了可用于流体冷却系统的微型热交换器的高纵横比，高表面积结构和其制造成本有效的方法。

公开(公告)号：US20090046423A1

公开(公告)日：2009-02-19

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US07746634B2

公开(公告)日：2010-06-29

申请号：US12221961

申请日：2008-08-07

申请人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

发明人： James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Douglas E. Werner ,  Norman Chow ,  Adrian Correa ,  Brandon Leong ,  Sudhakar Gopalakrishnan ,  Richard Grant Brewer ,  Mark McMaster ,  Girish Upadhya

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： The rear panel of an electronics enclosure includes one or more heat exchangers. The rear panel can be cooling door configured to provide access to the cables and equipment located within the electronics enclosure. Such access can be provided by swinging the door open on hinges like a standard door. In the case where there are multiple heat exchangers, the door can be configured into segments, one segment per heat exchanger, and each segment includes hinges so as to be opened independently from the other segments. In some embodiments, each segment swivels open like a standard door. In other embodiments, each segment is configured to swivel up or down about a horizontal axis. In still other embodiments, each segment is configured to be disconnected from the electronics enclosure and moved out of the way, in which case each heat exchanger is connected using either flexible tubing that can be bent out of the way or quick disconnects. In other embodiments, the entire rear door, or each segment of the rear door, can be configured to slide open and closed like a drawer.

摘要翻译： 电子外壳的后面板包括一个或多个热交换器。 后面板可以是冷却门，其被配置为提供对位于电子外壳内的电缆和设备的访问。 可以通过在诸如标准门的铰链上使门打开来提供这种接近。 在具有多个热交换器的情况下，门可以被构造成段，每个热交换器一个段，并且每个段包括铰链，以便独立于其它段打开。 在一些实施例中，每个部分像标准门一样旋转打开。 在其他实施例中，每个段被配置成围绕水平轴向上或向下旋转。 在其他实施例中，每个部分被配置为与电子外壳断开连接，并且移出方向，在这种情况下，每个热交换器使用可以弯曲的方式或快速断开的柔性管连接。 在其他实施例中，整个后门或后门的每个部分可被构造成像抽屉一样滑动和关闭。

公开(公告)号：US07660117B2

公开(公告)日：2010-02-09

申请号：US12221945

申请日：2008-08-07

申请人： Douglas E. Werner ,  James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Richard Grant Brewer

发明人： Douglas E. Werner ,  James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Richard Grant Brewer

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

摘要翻译： 管道工作组件联接到容纳一个或多个发热设备（例如电子设备服务器）的电子设备外壳的端部。 管道工作组件包括单独的管道引导件，每个管道引导件具有可变形的端部，该可变形端部构造成围绕从一个或多个电子服务器的后部延伸的电连接线局部变形。 可变形端可由刷毛制成，如刷子或包括狭缝和/或孔的泡沫。

公开(公告)号：US20090046430A1

公开(公告)日：2009-02-19

申请号：US12228053

申请日：2008-08-07

申请人： Richard Grant Brewer ,  Hae-won Choi ,  James Hom ,  Tien Chih (Eric) Lin ,  Douglas E. Werner

发明人： Richard Grant Brewer ,  Hae-won Choi ,  James Hom ,  Tien Chih (Eric) Lin ,  Douglas E. Werner

IPC分类号： H05K7/20

CPC分类号： H05K7/20736

摘要： A cooling system includes a re-configurable duct work assembly for a server rack or other electronics enclosure. Heat generating devices are positioned within the electronics enclosure and heat exchangers are coupled to the heat generating devices via the duct work. The duct work is positioned within a plenum between the back of the electronics servers and the heat exchangers. The interior of the electronics enclosure is conceptually segmented into heat zones. The duct work is used to selectively direct heated air to the heat exchangers. In some embodiments, the heated air output from a single heat zone is directed by the duct work to a corresponding single heat exchanger. In other embodiments, the heated air output from a group of adjacent heat zones is combined within a single duct work guide that directs the combined heated air to a corresponding number of adjacent heat exchangers.

摘要翻译： 冷却系统包括用于服务器机架或其他电子设备外壳的可重构管道工作组件。 热产生装置位于电子设备外壳内，热交换器通过管道工作连接到发热装置。 管道工作位于电子服务器的背面和热交换器之间的集气室内。 电子外壳的内部在概念上分为热区。 管道工作用于选择性地将加热的空气引导到热交换器。 在一些实施例中，从单个加热区域输出的加热空气由管道工作引导到相应的单个热交换器。 在其它实施例中，来自一组相邻加热区域的加热空气输出在单个管道工作导向器内组合，其将组合的加热空气引导到相应数量的相邻热交换器。

公开(公告)号：US20090046429A1

公开(公告)日：2009-02-19

申请号：US12221945

申请日：2008-08-07

申请人： Douglas E. Werner ,  James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Richard Grant Brewer

发明人： Douglas E. Werner ,  James Hom ,  Hae-won Choi ,  Tien Chih (Eric) Lin ,  Richard Grant Brewer

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H05K7/20736

摘要： A duct work assembly is coupled to an end of an electronics enclosure that houses one or more heat generating devices, such as electronics servers. The duct work assembly includes individual duct guides that each have a deformable end, which is configured to locally deform around the electrical connection lines extending from the rear of one or more electronics servers. The deformable end can be made of bristles, as in a brush, or foam that includes slits and/or holes.

摘要翻译： 管道工作组件联接到容纳一个或多个发热设备（例如电子设备服务器）的电子设备外壳的端部。 管道工作组件包括单独的管道引导件，每个管道引导件具有可变形的端部，该可变形端部构造成围绕从一个或多个电子服务器的后部延伸的电连接线局部变形。 可变形端可由刷毛制成，如刷子或包括狭缝和/或孔的泡沫。

公开(公告)号：US08647916B2

公开(公告)日：2014-02-11

申请号：US13530370

申请日：2012-06-22

申请人： Kyung Hyun Kim ,  Je Ha Kim ,  Hae-won Choi ,  Dae-Hyung Cho ,  Yong-Duck Chung

发明人： Kyung Hyun Kim ,  Je Ha Kim ,  Hae-won Choi ,  Dae-Hyung Cho ,  Yong-Duck Chung

IPC分类号： H01L21/00

CPC分类号： H01L31/0749 ,  H01L31/0322 ,  Y02E10/541 ,  Y02P70/521

摘要： Methods for manufacturing a solar cell are provided. The method may include forming a lower electrode on a substrate, forming a light absorption layer on the lower electrode, forming a buffer layer on the light absorption layer, and forming a window layer on the buffer layer. The window layer may include an intrinsic layer and the transparent electrode which have electric characteristics different from each other, respectively. The intrinsic layer and the transparent electrode may be formed by a sputtering process using a single target formed of metal oxide doped with impurities.

摘要翻译： 提供太阳能电池的制造方法。 该方法可以包括在基板上形成下电极，在下电极上形成光吸收层，在光吸收层上形成缓冲层，在缓冲层上形成窗口层。 窗口层可以分别包括具有彼此不同的电特性的本征层和透明电极。 本征层和透明电极可以通过使用由掺杂有杂质的金属氧化物形成的单个靶的溅射工艺形成。

公开(公告)号：US20090225515A1

公开(公告)日：2009-09-10

申请号：US12381332

申请日：2009-03-10

申请人： James Hom ,  Richard Grant Brewer ,  Hae-won Choi

发明人： James Hom ,  Richard Grant Brewer ,  Hae-won Choi

IPC分类号： H05K7/20 ,  F28D15/00 ,  F28F1/10

CPC分类号： H05K7/20781 ,  E05D11/0081 ,  E05Y2800/10 ,  E05Y2900/132

摘要： A thermal bus enables the use of multiple separate heat pipe assemblies instead of using a single heat pipe assembly spanning the distance from heat source to cold plate. The use of a thermal bus can decrease the orientation effects as well as decrease the travel length of any single heat pipe assembly. In addition, the use of multiple heat pipe assemblies enables each individual heat pipe assembly to be optimized to meet localized heat transfer characteristics between each heat source, the thermal bus, and the cold plate. Such optimization can include the use of differently sized heat pipes, wick structures within the heat pipe, and working fluid used within the heat pipe. The thermal bus provides an intermediate thermal transfer from one heat pipe assembly serially coupled to another heat pipe assembly, thereby enabling multiple serially coupled heat pipe assemblies to transfer heat from a given heat source to the cold plate at the edge of the electronics board.

摘要翻译： 热母线可以使用多个单独的热管组件，而不是使用跨过热源到冷板的距离的单个热管组件。 使用热母线可以降低取向效果，并减少任何单个热管组件的行进长度。 此外，使用多个热管组件可使每个单独的热管组件得以优化，以满足每个热源，热母线和冷板之间的局部热传递特性。 这种优化可以包括使用不同尺寸的热管，热管内的芯结构以及在热管内使用的工作流体。 热母线提供从串联耦合到另一热管组件的一个热管组件的中间热传递，从而使得多个串联耦合的热管组件能够将热量从给定的热源传送到电子板的边缘处的冷板。