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    Re-workable metallic TIM for efficient heat exchange
    2.
    发明申请
    Re-workable metallic TIM for efficient heat exchange 审中-公开
    可重复使用的金属TIM，用于高效的热交换

    公开(公告)号：US20070175621A1

    公开(公告)日：2007-08-02

    申请号：US11345556

    申请日：2006-01-31

    申请人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

    发明人： Madhav Datta ,  Peng Zhou ,  James Hom ,  Mark Munch ,  Mark McMaster

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3736 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/73253

    摘要： A heat exchanging system uses a metallic TIM for efficient heat transfer between a heat source and a heat exchanger. The heat source is preferably an integrated circuit coupled to a circuit board. The metallic TIM preferably comprises indium. The metallic TIM is comprised of either a separate metallic TIM foil or as a deposited layer of metal material. The metallic TIM foil is mechanically joined to a first surface of the heat exchanger and to a first surface of the integrated circuit by applying sufficient pressure during clamping. Disassembly is accomplished by un-clamping the heat exchanger, the metallic TIM foil, and the integrated circuit from each other. Once disassembled, the heat exchanger and the metallic TIM foil are available to be used again. If the metallic TIM is deposited onto the heat exchanger, disassembly yields a heat exchanging sub-assembly that is also reusable.

    摘要翻译： 热交换系统使用金属TIM来在热源和热交换器之间进行有效的热传递。 热源优选为耦合到电路板的集成电路。 金属TIM优选包含铟。 金属TIM由单独的金属TIM箔或金属材料的沉积层组成。 金属TIM箔通过在夹紧期间施加足够的压力机械地连接到热交换器的第一表面和集成电路的第一表面。 通过将热交换器，金属TIM箔和集成电路彼此不夹紧来实现拆卸。 一旦分解，热交换器和金属TIM箔可以再次使用。 如果金属TIM沉积在热交换器上，则拆卸产生也是可重复使用的热交换子组件。

    Integrated liquid to air conduction module
    6.
    发明授权
    Integrated liquid to air conduction module 有权
    集成液体到空气传导模块

    公开(公告)号：US08157001B2

    公开(公告)日：2012-04-17

    申请号：US11731484

    申请日：2007-03-30

    申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

    发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

    IPC分类号： G05D23/00 ,  F28F7/00

    CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.

    摘要翻译： 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 泵连接到流体路径，形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。

    Integrated liquid to air conduction module
    7.
    发明申请
    Integrated liquid to air conduction module 有权
    集成液体到空气传导模块

    公开(公告)号：US20070227708A1

    公开(公告)日：2007-10-04

    申请号：US11731484

    申请日：2007-03-30

    申请人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

    发明人： James Hom ,  Girish Upadhya ,  Douglas E. Werner ,  Mark Munch ,  Paul Tsao ,  Bruce Conway ,  Peng Zhou ,  Richard Brewer

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20281 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated cooling system for cooling systems such as laptops or subsystems such as a graphics card is disclosed. An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. The invention includes a pump that is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a includes a programmable controller connect the an air-mover, pump and temperature sensing device. A reservoir can be connected to the fluid path.

    摘要翻译： 公开了一种用于诸如笔记本电脑或诸如图形卡的子系统之类的冷却系统的集成冷却系统。 集成冷却系统包括具有被配置为联接到热源的接触区域的第一层，其中第一层具有与热源与第一层热接触的接触区域相邻的流体路径。 耦合到第一层是附接有多个空气翅片的第二层。 本发明包括连接到流体路径的泵，其形成用于使流体循环通过第一层的封闭路径。 在第一层内，流体路径将包含多个流体翅片，其控制流体路径内的流体的流动。 在流体路径内，提供与一个或多个电子设备相邻的双计数器流的结构。 另外，流体路径可以包括微通道板结构。 该系统可以包括一个可编程控制器，连接一个空气推动器，泵和温度检测装置。 储存器可以连接到流体路径。

    Apparatus and method of efficient fluid delivery for cooling a heat producing device
    8.
    发明授权
    Apparatus and method of efficient fluid delivery for cooling a heat producing device 有权
    用于冷却发热装置的有效流体输送的装置和方法

    公开(公告)号：US07188662B2

    公开(公告)日：2007-03-13

    申请号：US11049313

    申请日：2005-02-01

    申请人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

    发明人： Richard Grant Brewer ,  Girish Upadhya ,  Peng Zhou ,  Mark McMaster ,  Paul Tsao

    IPC分类号： F28D7/02

    CPC分类号： H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A heat exchanger includes features for alleviating high pressure drops and controlling the expansion of fluid during freezing. The heat exchanger includes an interface layer in which heat is transferred from a heat source to a fluid. A manifold layer couples to the interface layer. The manifold layer includes a first set of substantially vertical fluid paths for directing the fluid to the interface layer. The manifold layer further includes a second set of substantially horizontal fluid paths, perpendicular to the first set of fluid paths, for removing the fluid from the interface layer. Preferably, the heat exchanger includes an upper layer for circulating the fluid to and from the manifold layer. The upper layer can include at least one of a plurality of protruding features and a porous structure. Preferably, a porous structure is disposed along the interface layer.

    摘要翻译： 热交换器包括用于缓解高压降和控制冷冻期间流体膨胀的特征。 热交换器包括热量从热源传递到流体的界面层。 歧管层耦合到界面层。 歧管层包括用于将流体引导到界面层的第一组基本垂直的流体路径。 歧管层还包括垂直于第一组流体路径的第二组基本水平的流体路径，用于从界面层移除流体。 优选地，热交换器包括用于将流体循环到歧管层和从歧管层循环的上层。 上层可以包括多个突出特征和多孔结构中的至少一个。 优选地，多孔结构沿着界面层设置。