公开(公告)号：US20120024959A1

公开(公告)日：2012-02-02

申请号：US13077390

申请日：2011-03-31

申请人： Madoka MINAGAWA ,  Naoya KANDA ,  Isao SAKAMA ,  Shigeru SAGAWA ,  Daisuke SHIBATA

发明人： Madoka MINAGAWA ,  Naoya KANDA ,  Isao SAKAMA ,  Shigeru SAGAWA ,  Daisuke SHIBATA

IPC分类号： G06K19/077 ,  H01L21/98

CPC分类号： H01Q1/2208 ,  G06K19/0772 ,  G06K19/07722 ,  G06K19/07754 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2224/0401

摘要： An RFID inlet by including: a base film; an antenna pattern formed on the base film; an insulation film layer formed on the antenna pattern and having a hole; an IC chip coupled to the antenna pattern inside the hole of the insulation film layer; and an underfill filled between the IC chip, the antenna, and the base film. The height of the IC chip top surface is at a higher level than the top surface of the insulation film layer, the underfill is formed between the IC chip and a wall surface of the hole of the insulation film layer.

摘要翻译： 一种RFID入口，包括：基膜; 形成在基膜上的天线图案; 形成在所述天线图案上并具有孔的绝缘膜层; IC芯片，耦合到绝缘膜层的孔内的天线图案; 以及填充在IC芯片，天线和基膜之间的底部填充物。 IC芯片顶面的高度比绝缘膜层的顶面高，在IC芯片与绝缘膜层的孔的壁面之间形成底部填充物。